Laird Technologies Precision Metals – NIC 3.0 EMI Gaskets
Laird Technologies Precision Metals – NIC 3.0 Electromagnetic Interference (EMI) Gaskets are precision components that meet Open Compute Project (OCP) – NIC 3.0 specifications. The NIC 3.0 specification defines a third-generation mechanical form factor that allows for interoperability between compliant baseboards and OCP NIC 3.0 cards. Laird Technologies Precision Metals – NIC 3.0 Modules address some of the limitations of NIC 2.0, such as board space, mechanical profile, connector placement, and specification quality.Features
- Precision components for OCP – NIC 3.0. NIC 3.0
- Small form factor (SFF) and large form factor (LFF) versions
- Modules include fingerstock and side-spring parts
NIC 3.0 Module Layout with Chassis
NIC 3.0 Module with Springs
Veröffentlichungsdatum: 2020-04-13
| Aktualisiert: 2025-06-19
