Laird
Laird designs and develops electronic device protection solutions, including EMI suppression, thermal management materials, structural and precision metals, and multi-functional products. Materials science experts enable improved protection, higher performance and reliability, custom structural designs and faster time-to-market.
Empfohlene Produkte von Laird
Tgrease™ 3000 Thermal Grease
Supports higher operating temperatures (+200°C), especially for SiC and GaN power semiconductors.
Tflex™ SF16 Thermal Gap Fillers
Innovative, high-performing thermal materials in the Laird non-silicone-based gap filler portfolio.
MAF06 High-Current Low DCR SMD Power Inductor
Power line noise suppression and desired power efficiency while delivering extremely low DCR.
Tflex™ HR6.5 Thermal Gap Filler
Thermal interface material with >6W/mK thermal conductivity with high recovery properties.