UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays

Samtec UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays are 0.635mm pitch high-density, high-speed signal/power arrays that achieve 64Gbps PAM4 speeds. These Samtech signal/power arrays feature rotated power blades for improved performance and simplified breakout region (BOR). These UDx6 AcceleRate MP series features 5mm and 10mm stack heights and up to 10 power and 240 signal positions. The signal/power arrays offer an open-pin-field design for routing and grounding flexibility. The series includes optional alignment pins, standard weld tabs for a secure connection to the board, and polarized guide posts for blind mating.

Risultati: 40
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Qtà RoHS Modello ECAD Prodotto
Numero di posizioni
Passo
Numero di righe
Stile di terminazione
Angolo di montaggio
Corrente nominale
Tensione nominale
Velocità dati massima
Temperatura di lavoro minima
Temperatura di lavoro massima
Placcatura del contatto
Materiale del contatto
Materiale di alloggiamento
Serie
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Scheda dati
2514.09.2026 previsto
Min: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Scheda dati
2507.09.2026 previsto
Min: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Scheda dati
2512.10.2026 previsto
Min: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Scheda dati
2520.10.2026 previsto
Min: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Scheda dati
2209.11.2026 previsto
Min: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Scheda dati
2519.10.2026 previsto
Min: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Scheda dati
2520.10.2026 previsto
Min: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2521.09.2026 previsto
Min: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2520.10.2026 previsto
Min: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2519.10.2026 previsto
Min: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2519.10.2026 previsto
Min: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2519.10.2026 previsto
Min: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2520.10.2026 previsto
Min: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2507.10.2026 previsto
Min: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2520.10.2026 previsto
Min: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2519.10.2026 previsto
Min: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2519.10.2026 previsto
Min: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2219.10.2026 previsto
Min: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2519.10.2026 previsto
Min: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2520.10.2026 previsto
Min: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2520.10.2026 previsto
Min: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2520.10.2026 previsto
Min: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Scheda dati
2520.10.2026 previsto
Min: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Scheda dati
2514.09.2026 previsto
Min: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Connettori Mezzanine scheda-scheda 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Scheda dati
Tempo di consegna, se non a magazzino 10 settimane
Min: 350
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6