Modules multiprotocoles

Résultats: 1 626
Sélectionner Image Référence Fab. Description Fiche technique Disponibilité Prix (CHF) Filtrer les résultats dans le tableau par prix unitaire basé sur votre quantité. Qté. RoHS Modèle de ECAO Série Fréquence Alimentation en sortie Type d'interface Tension d’alimentation - Min. Tension d’alimentation - Max. Température de fonctionnement min. Température de fonctionnement max. Type de connecteur d'antenne Dimensions Protocole : Bluetooth, BLE - 802.15.1 Protocole - Cellulaire, NBIoT, LTE Protocole - GPS, GLONASS Protocole - Sous-Ghz Protocole : Wi-Fi - 802.11 Protocole : ANT, Thread, Zigbee - 802.15.4 Qualification Conditionnement
Ezurio Modules multiprotocoles Module, BL54H20, Bluetooth LE, Chip Antenna, Tape and Reel
98421.10.2026 attendu
Min. : 1
Mult. : 1
: 1 000

BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C Chip 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Reel, Cut Tape
Ezurio Modules multiprotocoles Module, BL54H20, Bluetooth LE, MHF4, Tape and Reel
98621.10.2026 attendu
Min. : 1
Mult. : 1
: 1 000

BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C MHF4 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Reel, Cut Tape
Ezurio Modules multiprotocoles Module, BL54L15, Bluetooth LE, Chip Antenna, Cut Tape
1 54402.12.2026 attendu
Min. : 1
Mult. : 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio Modules multiprotocoles Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
1 00005.11.2026 attendu
Min. : 1
Mult. : 1
: 1 000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio Modules multiprotocoles Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape
22021.09.2026 attendu
Min. : 1
Mult. : 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Modules multiprotocoles Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Cut Tape
25021.09.2026 attendu
Min. : 1
Mult. : 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Modules multiprotocoles Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
25021.09.2026 attendu
Min. : 1
Mult. : 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Kaga FEI Modules multiprotocoles WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
30026.11.2026 attendu
Min. : 1
Mult. : 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Kaga FEI Modules multiprotocoles WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
30026.11.2026 attendu
Min. : 1
Mult. : 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Insight SiP Modules multiprotocoles nRF52832 LoRa Transceiver & BLE 5 Module US
1 092Sur commande
Min. : 1
Mult. : 1
902 MHz to 928 MHz, 2.4 GHz 22 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
GigaDevice Modules multiprotocoles RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
80020.11.2026 attendu
Min. : 1
Mult. : 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
GigaDevice Modules multiprotocoles RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
80001.01.2027 attendu
Min. : 1
Mult. : 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice Modules multiprotocoles RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
80001.01.2027 attendu
Min. : 1
Mult. : 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
u-blox Modules multiprotocoles Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
25012.10.2026 attendu
Min. : 1
Mult. : 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Modules multiprotocoles Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
75031.12.2026 attendu
Min. : 1
Mult. : 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Modules multiprotocoles IW611, 802.11ax+BT, 2 antenna pins
1 00017.08.2026 attendu
Min. : 1
Mult. : 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Modules multiprotocoles Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
50031.12.2026 attendu
Min. : 1
Mult. : 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Microchip Technology Modules multiprotocoles Wi-Fi + Bluetooth LE Module, Chip Antenna
50010.08.2026 attendu
Min. : 1
Mult. : 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Texas Instruments Modules multiprotocoles SimpleLink multipro tocol 2.4-GHz wirele Délai de livraison 26 Semaines
Min. : 1
Mult. : 1
: 2 000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Texas Instruments Modules multiprotocoles SimpleLink multipro tocol 2.4-GHz wirele 232En stock
Min. : 1
Mult. : 1
: 2 000

CC2652RSIP 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External 7 mm x 7 mm BLE ISM Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs Modules multiprotocoles 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1 07004.09.2026 attendu
Min. : 1
Mult. : 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape

Silicon Labs Modules multiprotocoles Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm
1 30005.08.2026 attendu
Min. : 1
Mult. : 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Silicon Labs Modules multiprotocoles SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
200Sur commande
Min. : 1
Mult. : 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Telit Cinterion Modules multiprotocoles
38710.08.2026 attendu
Min. : 1
Mult. : 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm NBIoT, LTE GPS, GLONASS Tray
Embedded Artists Modules multiprotocoles 2GF M.2 Module
4530.10.2026 attendu
Min. : 1
Mult. : 1

2.4 GHz to 5 GHz 4-Wire UART, SDIO 3.15 V 3.46 V - 20 C + 70 C u.FL 802.11 a/b/g/n/ac Bulk