congatec CPU- und Chip-Kühler

Ergebnisse: 101
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congatec CPU- und Chip-Kühler Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. 8Auf Lager
Min.: 1
Mult.: 1

congatec HPC/sILH-CSA-HP-T
congatec CPU- und Chip-Kühler Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5. 1Auf Lager
Min.: 1
Mult.: 1
32.9 mm 12 V
JUMPtec CPU- und Chip-Kühler COMe Active Uni Cooler (w/o HSP) 43Auf Lager
Min.: 1
Mult.: 1
14 mm 78 mm 87 mm 20 W
congatec CPU- und Chip-Kühler Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole. 2Auf Lager
Min.: 1
Mult.: 1

conga-MA7 Intel Elkhart Lake
congatec CPU- und Chip-Kühler *Passive cooling for Pico ITX module conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded 2Auf Lager
Min.: 1
Mult.: 1
conga-PA7 Intel Elkhart Lake
congatec CPU- und Chip-Kühler * Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole 4Auf Lager
Min.: 1
Mult.: 1

conga-SA7 Intel Elkhart Lake
congatec CPU- und Chip-Kühler Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread 11Auf Lager
Min.: 1
Mult.: 1

conga-TCA7 Intel Elkhart Lake
congatec CPU- und Chip-Kühler Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole. 5Auf Lager
Min.: 1
Mult.: 1

28 mm conga-HPC/cTLU Intel Tiger Lake-UP3
JUMPtec CPU- und Chip-Kühler HSK COMe-Basic active (w/o HSP) 7Auf Lager
81Auf Bestellung
Min.: 1
Mult.: 1
congatec CPU- und Chip-Kühler Standard active cooling solution and integrated 12V fan for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 3Auf Lager
Min.: 1
Mult.: 1
27.3 mm 12 V conga-JC370
congatec CPU- und Chip-Kühler Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 2Auf Lager
Min.: 1
Mult.: 1
27.3 mm 12 V conga-JC370
congatec HPC/cALP-CSA-HP-B
congatec CPU- und Chip-Kühler Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 1Auf Lager
Min.: 1
Mult.: 1
29 mm 12 V
congatec conga-TCR8/CSA-HP-B
congatec CPU- und Chip-Kühler Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. 1Auf Lager
Min.: 1
Mult.: 1

JUMPtec CPU- und Chip-Kühler COMe Active Uni Cooler2 (w/o HSP) 53Auf Lager
Min.: 1
Mult.: 1

JUMPtec 51099-0000-99-1
JUMPtec CPU- und Chip-Kühler SMARC Passive Uni Cooler (w/o HSP) 105Auf Lager
Min.: 1
Mult.: 1
JUMPtec CPU- und Chip-Kühler HSP COMe-cAP6 Cu-core threaded
1Auf Bestellung
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSA-B
congatec CPU- und Chip-Kühler Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
2erwartet ab 05.05.2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSA-T
congatec CPU- und Chip-Kühler Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.
2erwartet ab 05.05.2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSP-B
congatec CPU- und Chip-Kühler Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.
2erwartet ab 05.05.2026
Min.: 1
Mult.: 1

JUMPtec CPU- und Chip-Kühler HSK COMe-Basic passive (w/o HSP) Nicht-auf-Lager-Vorlaufzeit 28 Wochen
Min.: 1
Mult.: 1

congatec CPU- und Chip-Kühler Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded Nicht-auf-Lager-Vorlaufzeit 12 Wochen
Min.: 1
Mult.: 1

conga-MA7 Intel Elkhart Lake
JUMPtec CPU- und Chip-Kühler HSP COMe-cAP6 Cu-core through Nicht auf Lager
Min.: 1
Mult.: 1

JUMPtec CPU- und Chip-Kühler COMe Passive Uni Cooler (w/o HSP) N/A
Min.: 1
Mult.: 1

14 mm 78 mm 87 mm
JUMPtec CPU- und Chip-Kühler COMe Passive Uni Cooler2 slim (w/o HSP) Nicht auf Lager
Min.: 1
Mult.: 1

JUMPtec CPU- und Chip-Kühler COMe Passive Uni Cooler2 (w/o HSP) Nicht auf Lager
Min.: 1
Mult.: 1