Multiprotokoll-Module

Ergebnisse: 1 403
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Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – Mobilfunk, NBIoT, LTE
Protokoll – GPS, GLONASS
Protokoll – Sub-GHz
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Qualifikation
Verpackung
Renesas / Dialog Multiprotokoll-Module Wi-Fi/BLE Combo Module (u.FL connector)
Datenblatt
238Auf Lager
Min.: 1
Mult.: 1
: 500

DA16600 2.4 GHz 18 dBm I2C, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 14.3 mm x 24.3 mm x 3 mm Bluetooth 5.1 802.11 b/g/n Reel, Cut Tape
Intel AX210.NGWG.NVX
Intel Multiprotokoll-Module Intel Killer Wi-Fi 6E AX1675 x (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro 222Auf Lager
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax
Espressif Systems Multiprotokoll-Module 2.4 GHz, Wi-Fi and Bluetooth 5, 14 GPIOs, QFN-24, RISC-V Single-Core CPU
Datenblatt
4 492Auf Lager
Min.: 1
Mult.: 1

Silicon Labs Multiprotokoll-Module 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
Datenblatt
772Auf Lager
Min.: 1
Mult.: 1

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Tray
Telink Multiprotokoll-Module Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datenblatt
6Auf Lager
Min.: 1
Mult.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Espressif Systems Multiprotokoll-Module SMD module, ESP32-S3R8 with 8 MB Octal PSRAM die inside, 4 MB Quad SPI flash, PCB antenna
Datenblatt
4 060Auf Lager
1 950erwartet ab 21.07.2026
Min.: 1
Mult.: 1

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 65 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Bulk
Inventek Multiprotokoll-Module 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. 2MB External Flash. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE
Datenblatt
17Auf Lager
Min.: 1
Mult.: 1

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Insight SiP Multiprotokoll-Module nRF52832 LoRa Transceiver & BLE 5 Module AS
Datenblatt
64Auf Lager
Min.: 1
Mult.: 1
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
Intel Multiprotokoll-Module Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, vPro
Datenblatt
28Auf Lager
Min.: 1
Mult.: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
Telink Multiprotokoll-Module Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datenblatt
6Auf Lager
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Intel AX210.D2WG.NV
Intel Multiprotokoll-Module Intel Wi-Fi 6E AX210 (Gig+), 1216, 2x2 AX R2 (6GHz)+BT, No vPro
Datenblatt
644Auf Lager
1 000erwartet ab 13.04.2026
MouseReel verfügbar
Min.: 1
Mult.: 1
: 1 000

Wi-Fi 6 AX210 6 GHz PCIe, USB 0 C + 80 C 12 mm x 16 mm x 1.67 mm Bluetooth 5.3 802.11 ax Reel, Cut Tape, MouseReel
Intel AX210.NGWGIE.NV99ARN4
Intel Multiprotokoll-Module Intel Wi-Fi 6E AX210 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, Embedded, No vPro 106Auf Lager
200erwartet ab 20.04.2026
Min.: 1
Mult.: 1

Adafruit Multiprotokoll-Module ESP32-C6-WROOM-1-N8 Engineering Module - 8 MB Quad SPI Flash - PCB Antenna 20Auf Lager
Min.: 1
Mult.: 1

Bulk
Intel Multiprotokoll-Module Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, No vPro
Datenblatt
90Auf Lager
Min.: 1
Mult.: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax

Silicon Labs Multiprotokoll-Module Mighty Gecko ARM Cortex-M4 512 kB flash, 64 kB RAM module
Datenblatt
761Auf Lager
Min.: 1
Mult.: 1

MGM13P 2.4 GHz 10 dBm I2C, UART, USART 1.8 V 3.8 V - 40 C + 85 C Built-In 12.9 mm x 17.8 mm x 2.3 mm Bluetooth Thread, Zigbee Cut Tape
CEL Multiprotokoll-Module CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 Half-size Mini-PCIe Card
Datenblatt
2Auf Lager
Min.: 1
Mult.: 1

CMP9670 PCIe, USB Bluetooth Bulk
Silex Technology Multiprotokoll-Module [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108.
Datenblatt
15Auf Lager
Min.: 1
Mult.: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
Intel Multiprotokoll-Module Intel Wi-Fi 6 AX200, 1216, 2x2 AX+BT, No vPro , LTE Coex, UART
Datenblatt
486Auf Lager
Min.: 1
Mult.: 1

Wi-Fi 6 AX200 2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C 12 mm x 16 mm x 1.65 mm Bluetooth 5.2 LTE 802.11 ax
Pulse Electronics Multiprotokoll-Module USB 802.11 b/g/n BT module
746Auf Lager
Min.: 1
Mult.: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Silex Technology Multiprotokoll-Module [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f
Datenblatt
10Auf Lager
Min.: 1
Mult.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
DFRobot Multiprotokoll-Module ESP32-C3-MINI-1-N4 Module (PCB antenna) 27Auf Lager
Min.: 1
Mult.: 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n
Intel Multiprotokoll-Module Intel Wi-Fi 6 AX101, 2230, 1x1 AX+BT, No vPro
Datenblatt
62Auf Lager
Min.: 1
Mult.: 1

Wi-Fi 6 AX101 22 mm x 30 mm x 2.4 mm Bluetooth 802.11 ax


ADLINK Technology Multiprotokoll-Module AMPAK AP12356 WIFI/BT KIT 2x2 Wi-Fi + Bluetooth4.1 Module with PCI-e Half-Mini CardIEEE802.11a/b/g/n/ac, PCI-e interfaceOperating Temperature: -10 70? Driver for Win/Linux/Android2pcs x Antenna + 2pcs x IPEX cable 2Auf Lager
Min.: 1
Mult.: 1
2.4 GHz, 5 GHz 16 dBm PCIe, USB 3 V 3.6 V - 10 C + 70 C External Bluetooth 802.11 a/b/g/n/ac
Silicon Labs Multiprotokoll-Module Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Datenblatt
99Auf Lager
Min.: 1
Mult.: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 105 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silex Technology Multiprotokoll-Module [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount
Datenblatt
298Auf Lager
Min.: 1
Mult.: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk