RISC-V Kern Multiprotokoll-Module

Ergebnisse: 21
Auswählen Bild Teile-Nr.
 Herst.
Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Verpackung
Telink Multiprotokoll-Module Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datenblatt
6Auf Lager
Min.: 1
Mult.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Telink Multiprotokoll-Module Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datenblatt
6Auf Lager
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Espressif Systems Multiprotokoll-Module "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 669Auf Lager
1 950erwartet ab 21.07.2026
Min.: 1
Mult.: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Espressif Systems Multiprotokoll-Module SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Datenblatt
2 776Auf Lager
Min.: 1
Mult.: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Espressif Systems Multiprotokoll-Module "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 3 275Auf Lager
Min.: 1
Mult.: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
u-blox Multiprotokoll-Module ESP32-C6, 802.11ax+BLE, ant pin, open CPU, 4MB flash
Datenblatt
500Auf Lager
Min.: 1
Mult.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Multiprotokoll-Module ESP32-C6, 802.11ax+BLE, ant pin, open CPU, 8MB flash
Datenblatt
495Auf Lager
Min.: 1
Mult.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Multiprotokoll-Module ESP32-C6, 802.11ax+BLE, PCB ant, open CPU, 4MB flash
Datenblatt
473Auf Lager
Min.: 1
Mult.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Multiprotokoll-Module ESP32-C6, 802.11ax+BLE, PCB ant, open CPU, 8MB flash
Datenblatt
490Auf Lager
Min.: 1
Mult.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Seeed Studio Multiprotokoll-Module Seeed Studio XIAO ESP32C3
1 181Auf Lager
2 125erwartet ab 10.04.2026
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n
Seeed Studio Multiprotokoll-Module XIAO ESP32S3 - 2.4GHz WiFi, BLE 5.0, Dual-Core, Battery Charge,Smart Homes, IoT, Wearable Devices, Robotics
Datenblatt
1 653Auf Lager
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n
Espressif Systems Multiprotokoll-Module SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Datenblatt
7Auf Lager
3 250erwartet ab 23.06.2026
Min.: 1
Mult.: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
SparkFun Multiprotokoll-Module ESP32-C6 MINI Module - 4MB (PCB Antenna)
Datenblatt
8Auf Lager
Min.: 1
Mult.: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
Espressif Systems Multiprotokoll-Module "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for
4 868Auf Bestellung
Min.: 1
Mult.: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
SparkFun Multiprotokoll-Module ESP32-C6 WROOM Module - 16MB (PCB Antenna)
Datenblatt
29erwartet ab 11.05.2026
Min.: 1
Mult.: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
Telink Multiprotokoll-Module Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Espressif Systems Multiprotokoll-Module ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6(802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules.
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1
2.4 GHz, 5 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm Bluetooth WiFi Thread, Zigbee
GigaDevice Multiprotokoll-Module RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 800
Mult.: 800

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice Multiprotokoll-Module RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 800
Mult.: 800

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
Quectel Multiprotokoll-Module Wi-Fi 6, 2.4GHz, BLE5.2, RISC-V, ACK SDK for Matter, 4MB Flash, 512 KB SRAM, PCB antenna, -40C to 105C
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
Min.: 500
Mult.: 250
: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax Reel
Quectel Multiprotokoll-Module Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 1
Mult.: 1
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax