-ar Computer-On-Module - COM

Ergebnisse: 276
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ADLINK Technology Computer-On-Module - COM SMARC 2.1 with MediaTek Genio 1200 platform 8 GB LPDDR4 64 GB UFS AC wifi BT
Datenblatt
2Auf Lager
Min.: 1
Mult.: 1

256 kB 5 VDC SPI 0 C + 60 C
congatec Computer-On-Module - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. DisplayPort interface instead of LVDS. Commercial temperature ran
Datenblatt
15Auf Lager
Min.: 1
Mult.: 1

SMARC v2.0 NXP 0 C + 60 C 82 mm x 50 mm
Kneron Computer-On-Module - COM
Datenblatt
16Auf Lager
Min.: 1
Mult.: 1

ARM Kneron KL720 128 MB PCIe 0 C + 50 C 80 mm x 22 mm x 4.7 mm
Kneron Computer-On-Module - COM KL720 M.2 2242 B key compatible M.2 2242 B key with Kneron KL720 chip; Bundle Sell with PER-T720-M2AI-FAN01 (Cooler Fan) Unless Customer have their own Cooler in their system
Datenblatt
10Auf Lager
Min.: 1
Mult.: 1

ARM Kneron KL720 128 MB USB 0 C + 50 C 80 mm x 22 mm x 4.7 mm
Ka-Ro electronics Computer-On-Module - COM The QSMP-1351 is a QFN Style Solder-Down Computer On Module. The module with a small square size of 27mm and a height of 2.7mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 100 pads. The ground pad additionally acts as therm
Datenblatt
18Auf Lager
Min.: 1
Mult.: 1

ARM ARM Cortex-A7 650 MHz 256 MB 3.3 V CAN, Ethernet, I2C, SPI, UART, USB - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
ADLINK Technology Computer-On-Module - COM SMARC 2.1 with MediaTek Genio 1200 platform 8 GB LPDDR4X 64 GB UFS 0C to 60C
Datenblatt
8Auf Lager
Min.: 1
Mult.: 1

256 kB 5 VDC SPI 0 C + 60 C
Ka-Ro electronics Computer-On-Module - COM The QS91 is a solderable Sytem-on-Module with a size of only 27 by 27 mm.
Datenblatt
7Auf Lager
Min.: 1
Mult.: 1

ARM ARM Cortex-A55 32 kB, 32 kB, 256 kB 1.4 GHz 512 MB 3.3 V Ethernet, UART, USB - 25 C + 85 C
Ka-Ro electronics Computer-On-Module - COM The TXMP2 is a plug-in System-on-Module with 200 pins, designed for longevity.
Datenblatt
8Auf Lager
Min.: 1
Mult.: 1

NXP ARM Cortex-A35 1.5 GHz 5 V - 40 C + 85 C 67.6mm x 26 mm x 4 mm
Ka-Ro electronics Computer-On-Module - COM The TX91 is a plug-in System-on-Module with 200 pins, designed for longevity.
Datenblatt
7Auf Lager
Min.: 1
Mult.: 1

NXP ARM Cortex-A55 i.MX 91 1.4 GHz 3.3 V to 5 V - 25 C + 85 C 67.6 mm x 26 mm x 4 mm
Ka-Ro electronics Computer-On-Module - COM QS91/SOCK is a socketed version of the QS91 Sytem-on-Module. QS00-SV04 needed.
Datenblatt
7Auf Lager
Min.: 1
Mult.: 1

NXP ARM Cortex-A55 i.MX 9131 1.4 GHz 512 MB 3.3 V - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
congatec Computer-On-Module - COM COM-HPC Mini module based on Intel Core i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 12MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor
Datenblatt
2erwartet ab 18.05.2026
Min.: 1
Mult.: 1

COM-HPC Mini Intel Core i7-1365URE 1.2 GHz, 1.7 GHz 64 GB 32 GB 12 MB DP, DP++, Ethernet, GPIO, PCIe Gen3/4, SATA III, SPI, UART, USB 2.0, USB 3.2, USB 4.0 + 85 C 95 mm x 70 mm
congatec Computer-On-Module - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz +1x ARM Cortex-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.
Datenblatt
51Auf Bestellung
Min.: 1
Mult.: 1

SMARC v2.1 NXP i.MX 8M Plus Quad 1.6 GHz Audio, CAN, Ethernet, GPIO, I2C, PCIe, UART, USB - 40 C + 85 C 82 mm x 50 mm
congatec Computer-On-Module - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range.
Datenblatt
2erwartet ab 21.07.2026
Min.: 1
Mult.: 1

SMARC v2.0 NXP 0 C + 60 C 82 mm x 50 mm
congatec Computer-On-Module - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz +1x ARM Cortex-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.
Datenblatt
5Auf Bestellung
Min.: 1
Mult.: 1

SMARC v2.1 NXP i.MX 8M Plus Quad 1.6 GHz Audio, CAN, Ethernet, GPIO, I2C, PCIe, UART, USB - 40 C + 85 C 82 mm x 50 mm
congatec Computer-On-Module - COM SMARC 2.1 module with Intel Atom x6425RE quad core processor with 1.9GHz core frequency, 1.5MB cache, 4GB 4267MT/s LPDDR4x onboard memory and 32GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C. Nicht auf Lager
Min.: 1
Mult.: 1
0 C + 60 C
congatec Computer-On-Module - COM Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.8GHz +1x ARM Cortex-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial grade temperature range from 0 C to 60 C.
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1
1.5 MB Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 60 C
congatec Computer-On-Module - COM SMARC 2.1 module with TI Jacinto DRA829J processor (DRA829JM)Dual ARM Cortex A72
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

SMARC v2.1 Texas Instruments DRA829JM 2 GHz 8 GB 0 GB 8 MB 5 V CAN FD, DP, Ethernet, I2C, I2S, LVDS, MIPI-CSI, MIPI-DSI, PCIe, SDIO, UART, USB 2.0, USB 3.0 - 40 C + 85 C 82 mm x 50 mm
congatec Computer-On-Module - COM SMARC 2.1 module with TI Jacinto TDA4VM processor (TDA4VM88)Dual ARM Cortex A72
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

SMARC v2.1 Texas Instruments TDA4VM88 2 GHz 8 GB 0 GB 8 MB 5 V CAN FD, DP, Ethernet, I2C, I2S, LVDS, MIPI-CSI, MIPI-DSI, PCIe, SDIO, UART, USB 2.0, USB 3.0 - 40 C + 85 C 82 mm x 50 mm
congatec Computer-On-Module - COM SMARC 2.1 module with TI Jacinto TDA4VM processor (TDA4VM88)Dual ARM Cortex A72
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 1
Mult.: 1

SMARC v2.1 Texas Instruments TDA4VM88 2 GHz 8 GB 0 GB 8 MB 5 V CAN FD, DP, Ethernet, I2C, I2S, LVDS, MIPI-CSI, MIPI-DSI, PCIe, SDIO, UART, USB 2.0, USB 3.0 - 40 C + 85 C 82 mm x 50 mm
congatec Computer-On-Module - COM SMARC 2.1 module with TI Jacinto DRA829J processor (DRA829JM)Dual ARM Cortex A72
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

SMARC v2.1 Texas Instruments DRA829JM 2 GHz 8 GB 0 GB 8 MB 5 V CAN FD, DP, Ethernet, I2C, I2S, LVDS, MIPI-CSI, MIPI-DSI, PCIe, SDIO, UART, USB 2.0, USB 3.0 - 40 C + 85 C 82 mm x 50 mm
congatec Computer-On-Module - COM Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz +1x ARM Cortex-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
Min.: 1
Mult.: 1
Qseven Specification 2.1 NXP i.MX 8M Plus Quad 1.6 GHz Audio, CAN, Ethernet, GPIO, I2C, PCIe, UART, USB - 40 C + 85 C 70 mm x 70 mm
congatec Computer-On-Module - COM Qseven module with ultra low power Freescale ARM Cortex A9 dual core 800MHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Lidded FCBGA package. Industrial grade temperature range from -40 C to 85 C.
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 1
Mult.: 1

Qseven NXP i.MX 6Dual 800 MHz 1 GB 1 MB 1 MB 5 V - 40 C + 85 C 70 mm x 70 mm
congatec Computer-On-Module - COM Standard heatpipe based passive cooling solution for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370 with 15mm high fins and 20mm overall heat sink height. All stand-offs are M2.5 threaded.
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM SMARC Module based on high-performance industrial TI ARM processor TDA4VM Features 2x ARM Cortex-A72 @ 2.0GHz +2x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 2GB onboard LPDDR4x memory and 32GB onboard eMMC. Features U-Bl
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

SMARC v2.1 Texas Instruments TDA4VM88 2 GHz 8 GB 0 GB 8 MB 5 V CAN FD, DP, Ethernet, I2C, I2S, LVDS, MIPI-CSI, MIPI-DSI, PCIe, SDIO, UART, USB 2.0, USB 3.0 - 40 C + 85 C 82 mm x 50 mm
congatec Computer-On-Module - COM Standard heatpipe based passive cooling solution for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370 with 15mm high fins and 20mm overall heat sink height. Stand-offs are with 2.7mm bore hole.
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1