.050" LP Array™ Low Profile High-Density Arrays

Samtec .050 LP Array™ Low Profile, Open-Pin-Field High-Density Arrays feature a dual beam contact system on a 1.27mm x 1.27mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. The series is available in 4mm, 4.5mm, and 5mm mated heights with up to 320 total pins in 4-, 6- or 8-row configurations. These Samtec connectors support 28+ Gbps applications and are Final Inch® certified for Break Out Region trace routing recommendations to save time and be cost-effective. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

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Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
117Auf Lager
Min.: 1
Mult.: 1
Rolle: 350

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
781Auf Lager
Min.: 1
Mult.: 1
Rolle: 500

Sockets 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
582Auf Lager
Min.: 1
Mult.: 1
Rolle: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
178Auf Lager
Min.: 1
Mult.: 1
Rolle: 325

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
387Auf Lager
Min.: 1
Mult.: 1
Rolle: 550

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
272Auf Lager
Min.: 1
Mult.: 1
Rolle: 300

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
390Auf Lager
Min.: 1
Mult.: 1
Rolle: 500

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
151Auf Lager
Min.: 1
Mult.: 1
Rolle: 700

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM LP ARRAY HS HD ARRAY
Datenblatt
325Auf Lager
Min.: 1
Mult.: 1
Rolle: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
460Auf Lager
Min.: 1
Mult.: 1
Rolle: 550
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
260Auf Lager
Min.: 1
Mult.: 1
Rolle: 550

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
206Auf Lager
Min.: 1
Mult.: 1
Rolle: 500

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
464Auf Lager
Min.: 1
Mult.: 1
Rolle: 550

Sockets 24 Position 1.27 mm (0.05 in) 6 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
377Auf Lager
Min.: 1
Mult.: 1
Rolle: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
149Auf Lager
Min.: 1
Mult.: 1
Rolle: 325

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
130Auf Lager
Min.: 1
Mult.: 1
Rolle: 325

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
318Auf Lager
Min.: 1
Mult.: 1
Rolle: 350
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
1 268Auf Lager
Min.: 1
Mult.: 1
Rolle: 625

Headers 40 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
322Auf Lager
Min.: 1
Mult.: 1
Rolle: 475

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
162Auf Lager
Min.: 1
Mult.: 1
Rolle: 325

LPAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
203Auf Lager
Min.: 1
Mult.: 1
Rolle: 450

Headers 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
215Auf Lager
Min.: 1
Mult.: 1
Rolle: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
227Auf Lager
Min.: 1
Mult.: 1
Rolle: 475

Plugs 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
99Auf Lager
Min.: 1
Mult.: 1
Rolle: 325

Headers 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datenblatt
175Auf Lager
Min.: 1
Mult.: 1
Rolle: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape