Wakefield Thermal ulTIMiFlux™ Thermally Conductive Gap Filler

Wakefield Thermal ulTIMiFlux™ Thermally Conductive Gap Filler comprises an ultra-soft thermally conductive silicone supplied as a two-component liquid dispensable material. The thixotropic gap filler from Wakefield Thermal is designed to remain where it is dispensed, conform to the surface, and cure in place. This provides thermal protection at thin bond lines with little to no stress on the components during assembly.