Trenz Electronic TE0813-02-3BE81-AS Starter Kit
Trenz Electronic TE0813-02-3BE81-AS Starter Kit consists of a TE0813-02-3BE81-A module with ZU3EG on a TEBF0818-02 baseboard with a pre-assembled heatsink. This starter kit is housed in a black Core V1 mini-ITX enclosure. The TE0813-02-3BE81-A MPSoC module features onboard an oscillator and a programmable 4-channel PLL clock generator. This MPSoC module has a plug-on module for interface with four 240-pin B2B connectors (ADM6), 65 PS MIO, I2C, and JTAG. The TEBF0818-02A baseboard features a mini-ITX form factor, a SATA connector, onboard DC-DC Power SOCs, a 20-pin Arm® JTAG connector, and a microSD/MMC card socket. The Core V1 mini-ITX enclosure features two expansion slots, multiple drive slots, 140mm maximum CPU cooler height, and 260mm x 276mm x 316mm dimensions.
Features
- TE0813-02-3BE81-A MPSoC module:
- FPGA:
- AMD Zynq™ UltraScale+™ XCZU3EG-1SFVC784E device
- -1 speedgrade
- Extended temperature range
- SFVC784 package
- Grafikprozessor-Unit (GPU)
- RAM / storage:
- 4GB DDR4 SDRAM
- 128MB QSPI boot flash
- 2Kbit serial EEPROM with EUI-48 node identity
- Onboard:
- Oscillator
- Programmable 4-channel PLL clock generator
- Interface:
- Plug-on module with 4 x 240 pin B2B connectors (ADM6)
- 204 PL IO
- 65 PS MIO
- 4 PS GTR
- I2C and JTAG
- FPGA:
- TEBF0818-02A baseboard:
- Mini-ITX form factor, PC enclosure compatible
- ATX-24 power supply connector
- Optional 12V standard power plug
- Headers:
- Intel 10-pin HDA audio
- Intel 9-pin power/reset button and power-/HD-LED
- PC-BEEPER
- Onboard power-/reset-switches
- 2 x configuration 4-bit DIP switches
- 2 x optional 4-wire PWM fan connectors
- PCIe slot - one PCIe lane (16 lane connector)
- CAN FD transceiver (10-Pin IDC connector and 6-pin header)
- 4 x onboard configuration EEPROMs (1 x Microchip 24LC128-I/ST and 3 x Microchip 24AA025E48T-I/OT)
- Dual SFP+ connector (2x1 cage)
- 1 x DisplayPort (single lane)
- 1 x SATA connector
- 2 x USB 3.0 A connector (superspeed Host Port (High-speed at USB 2.0))
- 1 x USB 3.0 on-board connector with two ports
- FMC HPC slot (FMC_VADJ max. VCCIO)
- FMC fan
- Gigabit Ethernet RGMII PHY with RJ45 MagJack
- All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface
- Quad programmable PLL clock generator
- 2 x SMA coaxial connectors for clock signals
- MicroSD/MMC card socket (bootable)
- 64 GBit (8 GByte) on-board eMMC Flash
- 2 x System controller CPLDs Lattice MachXO2 1200 HC
- 1 x Samtec FireFly (4 GT lanes bidirectional)
- 1 x Samtec FireFly connector for reverse loopback
- 20-pin Arm® JTAG connector (PS JTAG0)
- 3 x Pmod connector (GPIO's and I²C interface to SC CPLDs and MPSoC module)
- On-board DC-DC PowerSoCs
- 170mm × 170mm size
- 5mm mating height with standard connectors
- Core V1 mini-ITX enclosure - technical features:
- 260mm x 276mm x 316mm (B x H x T) dimensions
- Steel material
- Black color
- Drive slots: 2 x 3.5inch (intern, 3.5 inch) and 2 x 2.5inch (intern, 2.5 inch)
- 2 x expansion slots
- I/O-panel: 2 x USB 3.0 and 1 x audio in/out each
- 255mm maximum graphic card length (inner enclosure)
- 285mm maximum graphic card length (outer enclosure)
- 140mm maximum CPU cooler height
- 200mm maximum length power supply
Kit Contents
- 1 x Core V1 mini-ITX enclosure- black with viewing window and removable sled walls
- 1 x Power supply BN292 pure power 11, 400W, and 80 PLUS (with fan)
- 1 x TE0813-02-3BE81-A MPSoC module with AMD Zynq™ UltraScale+™ ZU3EG
- 1 x TEBF0818-02A baseboard
- 1 x Heatsink SuperGrip ATS-X50230B-C1-R0 23mm x 23mm x 7.5mm
- 1 x TE0790-03 XMOD FTDI JTAG adapter (compatible with AMD-tools), pre-assembled on the carrier board
- 1 x TE0790-03L XMOD FTDI JTAG adapter (independent from AMD-tools), pre-assembled on the carrier board
- 1 x 32GB Class 10 UHS1 microSDHC incl. adapter
- 1 x USB cable, Type A to Type B mini, and 2 meter length
- 1 x power cable Schuko 1.8m black
- 4 x Phillips screws, M3 x 6, pan head, and zinc coated
Veröffentlichungsdatum: 2025-02-20
| Aktualisiert: 2025-03-02