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Molex 105443-Serie Wasserdichte Micro-USB-Steckverbinder

Molex 105443 Series Waterproof Micro-USB Connectors are mechanically robust connectors that withstand post-solder reflow while preventing water ingression at IP7 level. The connectors feature insert-mold housing that ensures reinforced terminal retention to housing, wide terminal contacts to provide higher current-carrying capacity of 2.0A than USB-IF and chamfered terminal contact tips to facilitate smooth mating with plug terminals at 10,000 durability cycles.

Merkmale

  • IP67-rated high sealing protection safeguards costly mobile device application investments
  • Right-angle, top-mount, SMT with through-hole mounting tabs
  • Wide terminal contacts provide a higher current-carrying capacity (2.0A) than USB-IF (1.80A)
  • Chamfered terminal contact tips facilitate smooth mating of the plug terminals with a 10,000 cycle durability
  • Plug-stopper on the shell enables the connector to withstand excessive insertion force when mated with the cable plug
  • Shell design with mating-angle and dimension-control reduces wear-and-tear on the shell while ensuring an insertion or withdrawal force beyond the 10,000 cycle durability
  • Insert-molded housing ensures reinforced terminal retention to the housing with mechanical robustness and superior co-planarity before and after reflow soldering
  • Halogen-free and RoHS compliant

Applikationen

  • Smartphones and mobile devices (I/O connectors)
  • Mobile and smartphones
  • Tablet PCs
  • Consumer
  • Digital cameras
  • Camcorders

Technische Daten

  • Electrical
    • 30VAC(rms) maximum voltage rating
    • Maximum current
      • 1.0A for signal pins 2, 3, and 4
      • 1.8A for power pins 1 and 5
    • 40mΩ maximum low-level contact resistance
    • 100VAC(rms) dielectric withstand voltage
    • 1000MΩ minimum insulation resistance
  • Mechanical
    • 35N maximum mating force
    • 8N to 25N unmating force range
    • 10,000 cycle durability
  • -30°C to +85°C operating temperature range
  • Materials
    • Black UL 94V-0 LCP housing
    • Stainless steel shell and metal tabs
    • Plating
      • Gold flash over 0.75µ palladium/nickel (Pd/Ni)
      • Gold flash on the solder tail area
      • 2.0µ minimum nickel underplating

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Veröffentlichungsdatum: 2015-08-28 | Aktualisiert: 2022-03-11