1Global Soldered MFF2 LPWAN eSIM
1Global Soldered MFF2 LPWAN eSIM is smaller than the head of a match and offers simple out-of-the-box connectivity. The embedded SIM or eSIM works like traditional SIM cards, but users don’t need a physical SIM card. The devices are “hard-wired” into relevant devices and can be activated by downloading and installing an eSIM profile. Mobile Network Operators (MNOs) can then provide the eSIM entirely remotely via software called a Remote SIM Provisioning (RSP) Platform. eSIMs make it easier for MNOs to manage connections over the air. The eSIM can hold multiple account details, permitting users to select between them at the touch of a button instead of swapping physical SIMs.
The 1Global Soldered MFF2 LPWAN eSIM supplies 12 months of 50MB or 125MB pre-paid data.
The 1Global Soldered MFF2 LPWAN eSIM propels the future of other connected devices such as laptops, tablets, and smartwatches, and allows easy connection without buying additional physical SIM cards. eSIMs are also super-charging IoT for connected devices worldwide - from smart home gadgets to vehicle tracking systems, anything connected to a network can now do so more efficiently and flexibly with eSIM.
Features
- Remote SIM provisioning compliant with GSMA M2M and SIM alliance specifications
- Built-in bootstrap connectivity profile
- Up to 10x operator profiles on a single eSIM
- Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT-M networks
- SIM / USIM / ISIM / CSIM network access applications supported
- Power saving features
- Secure element access control (ARF / PKCS#15)
- OTA capability over SMS, CAT-TP, and HTTPS (including DNS)
- Multi-interfaces able to combine eSIM + eSE
Applications
- Smartphones
- Laptops
- Tablets
- Smart watches
- IoT
- Vehicle trackers
- Payment terminals
Specifications
- Qualification
- Common criteria EAL5+
- Industrial qualification (JEDEC JESD47)
- Electrical supply voltages (all formats)
- Class A (5V)
- Class B (3V)
- Class C (1.8V)
- Operational temperature characteristics
- Temperature range (4FF) -25°C to +85°C
- Extended range (MFF2) -40°C to +105°C
- Supported clock division factors
- F/D = 372 (F=372, D=1)
- F/D = 64 (F=512, D=8)
- F/D = 32 (F=512, D=16)
- F/D = 16 (F=512, D=32)
- F/D = 8 (F=512, D=64)
- Memory Sizes
- 1280K total Flash size
- 380K / 512K (Ext) Flash available
- 30K RAM total, 7K for applets
- NVRAM characteristics
- 100K / 500K (Ext) endurance cycles (min) at +25°C
- 10Y / 25Y (Ext) data retention (min) at +25°C
- 3ms/6ms Page/Sector erase time
- 2.5ms Page write time
- Cryptographic features and accelerators
- Crypto-coprocessor
- 3DES engine
- AES engine
- True RNG
- CRC
- CPA /DPA countermeasures
- Form factors
- 3-in-1 Plug-in SIM (2FF, 3FF and 4FF)
- DFN8 (MFF2)
- WLCSP
Additional Resources
Associated Products
1Global Removable Plastic LPWAN eSIM
Removable Plastic LPWAN eSIM is triple-cut, with 12 or 36 months of 125MB or 250MB pre-paid data.
1Global MFF2 LTE (Critical) Soldered eSIM
MFF2 LTE (Critical) Soldered eSIM supplies 3 or 12 months of 500MB or 1GB pre-paid data.
1Global Removable Plastic LTE (Critical) eSIM
LTE eSIM is triple-cut and supplies 3, 12, or 36 months of 500MB, 1GB, or 3GB of pre-paid data.
