Octavo Systems Featured Products
OSD62x-PM System-in-Package (SiP)
Integrates the Texas Instruments AM62 processor, DDR4 memory, and essential passive components.
OSD62-PM-BRK Flexible Open Development Platform
Designed for the OSD62x-PM system-in-package with a 4-layer design with no backside components.
OSD32MP1-BRK Prototyping-Plattform für OSD32MP15x
Entwicklungsplattform für das OSD32MP15x SiP, das auf dem STM32MP1 von STMicroelectronics basiert.
OSD32MP15x System-in-Package (SiP)-Bauteile
Kombiniert den STM32MP1 MCU von STMicroelectronics mit einem Grafikprozess, ADC und mehr in einem BGA-Gehäuse.
OSD335x-SM Family of System-In-Package Devices
Provides OEM and system developers the added benefit of the full industrial temperature range.
OSD3358-SM-Red Evaluation Board
Designed for quick evaluation and development with OSD335x-SM family of SiPs.