Novità Computer-On-Module - COM
DFRobot DFR1295 LattePanda Mu Ultra x86 Compute Module is a credit-card-sized, high-performance AI compute module designed for edge intelligence, robotics, and embedded computing applications. Powered by an Intel Core Ultra 7 Processor 256V, integrated Intel Arc 140V GPU, and Intel AI Boost NPU, the module delivers up to 115 TOPS of combined AI performance. This processing capability enables local execution of large language models, computer vision, speech processing, and machine learning workloads without requiring cloud connectivity.
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DFRobot DFR1295 LattePanda Mu Ultra x86 Compute ModuleAI compute module designed for edge intelligence, robotics, and embedded computing applications.05.10.2026
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Axiomtek CEM570 COM Express Type 6 ModulesBased on Intel® processor technology and designed for embedded computing applications.29.07.2026 -
Advantech Modulo COM Express Tipo 6 SOM-6873 AMD Ryzen 8000Progettato per leapplicazioni di gaming e presenta una progettazione di piedinatura compatta tipo6.25.08.2025 -
Ka-Ro Electronics QSMP2 Solder-Down Computer On ModulesFeature up to 60x 3.3V general purpose I/O and LVDS display interface.21.03.2025 -
Advantech I moduli SOM-7533 COM Express® Mini Type10Costruiti con processori Intel® Core™ i3, serie N e processori serie Atom® x7000 (Alder Lake-N/Amston Lake).30.01.2025 -
ADLINK Technology Moduli MXM Nvidia RTX integratiPresentano la grafica integrata NVIDIA alimentata dall'architettura Ampere.06.06.2024 -
ADLINK Technology Moduli Nvidia Quadro T1000 integrato MXMFunzionalità grafica NVIDIA integrata costruita sull'architettura su Turing™.03.06.2024 -
DFRobot Modulo di calcolo Micro x86 Mu LattePandaPresenta un processore Intel N100 quad-core, memoria 8 GB LPDDR5 e archiviazione 64 GB.28.05.2024 -
Advantech Computer-on-Module OSM 1.1 ROM-2620Computer-on-Module OSM 1.1 alimentato dal SoC NXP i.MX 8ULP.10.05.2024 -
NexAIoT ICES622X Computer-On-Module (COM)COM Express Type 6 compact-size module that features Intel® Atom™ X6000 processors.23.03.2024 -
NexAIoT SMC250 SMARC 2.1 Computer-On-Module (COM)Features an Intel Atom® x5-E3940 Quad Core processor in an 82mm x 50mm short-size module dimension.17.01.2024 -
Ka-Ro Electronics QFN Style Solder-Down Computer On ModuleSingle-sided, assembled in a small square size of 27mm and a height of 2.6mm.07.01.2024 -
Ka-Ro Electronics TXMP2 Computer On ModulePart of the TX family and includes an STM32MP255 processor with 1.5 GHz dual Arm® Cortex®-A35.07.01.2024 -
Ka-Ro Electronics TX91 Computer On ModuleComplete computer implemented on a board smaller than a credit card.07.01.2024 -
ADLINK Technology Moduli di misura di base Express-RLP COM Express tipo 6Moduli di dimensioni base tipo 6 basati sul processore mobile Intel® Core™ di 13a generazione.21.12.2023 -
NexAIoT ICES676S Computer-On-Module (COM)COM Express Type 6-pinouts basic module that supports 12/13th Generation Intel® Core™ processors.09.11.2023 -
ADLINK Technology Modulo Express-ADP tipo 6Alimentato dal processore Intel ® Core ™ di 12a generazione con un’architettura ibrida innovativa.23.08.2023 -
ADLINK Technology Modulo Express-ID7Basato sul processore Intel ® Xeon ® D-1700 con Ethernet ad alta velocità integrato per un massimo di 4 10 G.23.08.2023 -
Ka-Ro Electronics TX93 Computer-on-Module (COM)Features a 1.5GHz Dual ARM® Cortex®-A55 processor based on the NXP i.MX 93.20.07.2023 -
Ka-Ro Electronics QS93 QFN-Style Solder-Down Computer-on-Module100-pin QFN lead-styled module measures 27mm2 x 2.6mm in height and provides a single-sided assembly20.07.2023 -
congatec COMe-cAP6 COM Express® w/ Intel® Core™ ProcessorsBoasts the power of 12th Generation Intel Core Processors, supporting up to 64GByte LPDDR5 memory.01.04.2023 -
ADLINK Technology Moduli di dimensione di base Express-TL COM Express tipo 6Basato sui processori Intel® Core™, Xeon® W e Celeron® 6000 di 11a gen.02.02.2023 -
ADLINK Technology Modulo cExpress-TL COM Express tipo 6Supporta PCI Express di 4a gen. a 16GT/s e quattro porte USB 3,2 con velocità di trasferimento fino a 10 Gb/s.02.02.2023