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Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap Filler
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap Filler
05.30.2024
Silicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®
05.27.2024
Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.
Bergquist Company Applicazioni Data Center
Bergquist Company Applicazioni Data Center
04.01.2023
I materiali avanzati aiutano a gestire la termografia, l’affidabilità a lungo termine e la protezione da sollecitazioni.
Visualizzazione: 1 - 3 di 3

StarTech High-Performance Silicone Thermal Paste
StarTech High-Performance Silicone Thermal Paste
04.08.2026
Designed for efficient heat transfer and safe application in various environments.  
Bourns Chip jumper termici BTJ
Bourns Chip jumper termici BTJ
02.02.2026
Componenti a montaggio superficiale esclusivi che forniscono un'elevata conducibilità termica per la dissipazione termica.
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™
11.06.2025
Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.
Qnity Tflex™ HR6.5 Thermal Gap Filler
Qnity Tflex™ HR6.5 Thermal Gap Filler
09.15.2025
Thermal interface material with >6W/mK thermal conductivity with high recovery properties.
Qnity Tflex™ CR350S 2-Part Dispensable Gap Fillers
Qnity Tflex™ CR350S 2-Part Dispensable Gap Fillers
09.09.2025
Provide high thermal conductivity, low thermal resistance, and high reliability.
Qnity Tputty™ SF560 1-Part Dispensable Gap Fillers
Qnity Tputty™ SF560 1-Part Dispensable Gap Fillers
08.25.2025
Offers thermal conductivity of 5.6W/mK, along with superior thermal resistance.
Wakefield Thermal ulTIMiFlux Dielectric Phase Change TIM
Wakefield Thermal ulTIMiFlux Dielectric Phase Change TIM
07.23.2025
Thermally conductive electrical insulators for semiconductor-to-heat sink interfaces
Qnity Tflex™ CR550 2-Part Dispensable Gap Filler
Qnity Tflex™ CR550 2-Part Dispensable Gap Filler
10.25.2024
Transfers unwanted heat in automotive components and the A+B putty material cures in place.
Qnity Tflex SF7 Thermal Gap Fillers
Qnity Tflex SF7 Thermal Gap Fillers
09.10.2024
Innovative, high-performing thermal material with silicone-free construction.
Qnity Tflex SF4 Thermal Gap Fillers
Qnity Tflex SF4 Thermal Gap Fillers
09.10.2024
Silicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap Filler
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap Filler
05.30.2024
Silicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®
05.27.2024
Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip Resistors
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip Resistors
01.18.2024
Features chip sizes ranging from 0603 to 2512.
MG Chemicals Non-Silicone Liquid Thermal Gel
MG Chemicals Non-Silicone Liquid Thermal Gel
10.30.2023
1-part gel that offers extreme thermal conductivity and flame retardancy.
LeaderTech Pad termici in fibra di carbonio ultrasottile TCF
LeaderTech Pad termici in fibra di carbonio ultrasottile TCF
10.18.2023
Bassa resistenza termica, superficie morbida e utilizza principalmente la fibra di carbonio come riempitivo termicamente conduttivo.
LeaderTech Pad termici ultrasottili TGN
LeaderTech Pad termici ultrasottili TGN
10.18.2023
Presentano una bassa resistenza termica ed è realizzata combinando grafene e silicone. 
LeaderTech Foglio di indio composito TCI
LeaderTech Foglio di indio composito TCI
10.18.2023
Transizioni da solido a liquido nel punto di fusione e di nuovo solido a temperatura ambiente.
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal Grease
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal Grease
09.27.2023
Feature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.
Qnity CoolZorb 200 Hybrid TIM/EMI Absorbers
Qnity CoolZorb 200 Hybrid TIM/EMI Absorbers
09.08.2023
Hybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.
Bergquist Company Applicazioni Data Center
Bergquist Company Applicazioni Data Center
04.01.2023
I materiali avanzati aiutano a gestire la termografia, l’affidabilità a lungo termine e la protezione da sollecitazioni.
Qnity Tpcm™ 7000 High-Performance TIMs
Qnity Tpcm™ 7000 High-Performance TIMs
08.03.2022
Designed to enhance the cooling of the thermal challenges in electronics.
Qnity Tflex™ HD7.5 Thermal Gap Filler
Qnity Tflex™ HD7.5 Thermal Gap Filler
08.03.2022
Soft silicone material that offers high deflection and 7.5W/mK thermal conductivity.
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