congatec Embedded Lösungen

Computer-On-Module - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface

Entwicklungsplatinen & -kits - x86 COMe Eval Carrier T7

Computer-On-Module - COM JUMPtec COMe mini Passive Uni Cooler (w/o HSP)

Entwicklungsboards und Kits - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

Computer-On-Module - COM COM Express Type 6 Compact module based on Intel Core i3-1320PRE

Computer-On-Module - COM COM Express Type 6 Compact module based on Intel Core Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores P-cores 1.4Ghz up to 4.8GHz (turbo) E-Cores 0.9GHz up to 3.8GHz (turbo) Low Power E-cores up to 2.5GHz (turbo) Integra

Computer-On-Module - COM COM Express Type 6 Compact module with Intel Core i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

Modulezubehör Cable Kit for conga-PA5 containing cab-Pico-ITX-USB2.0-Twin, cab-Pico-ITX-Audio Cable Adapter, cab-Pico-ITX-Buttons-LED, cab-Pico-ITX-GPIO, cab-Pico-ITX-RS232, cab-Pico-ITX-RS485, cab-Pico-ITX-External-Power, cab-Pico-ITX-Feature and cab-Pico-ITX-SAT

Computer-On-Module - COM JUMPtec COMe-cVR6 V1202B

Computer-On-Module - COM JUMPtec COMe Mount Kit 5mm 1set

Computer-On-Module - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6100E quad core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.

Computer-On-Module - COM COM HPC Size A module with Intel Core i3-1115GRE Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.