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congatec cab-LVDV-PWR-10-15
congatec Flachkabel/IDC-Kabel POWER CABLE FOR LVDS TO DVI ADAPTER 2Auf Lager
Min.: 1
Mult.: 1

congatec HPC/cALP-HSP-HP-B
congatec Wärmeableitungen Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole. 12Auf Lager
Min.: 1
Mult.: 1
congatec cab-LVDS SHDR-40V, Open End
congatec Computerkabel Cable for LVDS Panel with JST SHDR-40V connector, 50 cm, Open End, matches also with conga-JC370. 1Auf Lager
Min.: 1
Mult.: 1
congatec TCV2/HSP-HP-B
congatec Wärmeableitungen Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. 2Auf Lager
Min.: 1
Mult.: 1
JUMPtec 34014-0000-99-3
JUMPtec Wärmeableitungen HSP COMe-mRP10 Cu-core slim through 3Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Type 7 Basic module based on Intel Atom C3308 2-core processor with 1.6 GHz, 4MB Cache and dual channel DDR4 2133 MT/s memory interface for up to 64 GByte (formerly Denverton). Features four 2.5GbE KX interface ports. Commercial tempera 2Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Type 6 Compact module based on Intel Core i3-1320PRE 3Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM HPC Size A module with Intel Core i3-1115GRE Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp. 3Auf Lager
Min.: 1
Mult.: 1
JUMPtec CPU- und Chip-Kühler COMe Active Uni Cooler2 (w/o HSP) 44Auf Lager
Min.: 1
Mult.: 1

JUMPtec Computer-On-Module - COM COMe-bTL6 W-11865MLE RM590E 2Auf Lager
Min.: 1
Mult.: 1

congatec Wärmeableitungen Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0 129Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Type 7 Basic module based on AMD embedded EPYC 3255 8-core processor (single die) with 2.5GHz up to 3.1 GHz turbo boost, 16MB L3 cache and dual channel DDR4 2666 MT/s memory interface (formerly Snowy Owl). 2Auf Lager
Min.: 1
Mult.: 1

congatec Wärmeableitungen Standard Heat spreader for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole 265Auf Lager
1Auf Bestellung
Min.: 1
Mult.: 1
congatec Computer-On-Module - COM COM HPC Size A module with Intel Core i7-1185GRE Processor, quad core with 2.8GHz (up to 4.4GHz), 12MB L2 cache, GT96 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp. 1Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM-HPC client module based on Intel Xeon Processor W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset 1Auf Lager
Min.: 1
Mult.: 1

JUMPtec 36028-0000-99-1
JUMPtec Computer-On-Module - COM JUMPtec HSP COMe-cWL6 Cu-core through 127Auf Lager
3Auf Bestellung
Min.: 1
Mult.: 1
JUMPtec Computer-On-Module - COM JUMPtec COMe-mBTi10 E3827 2GB 19Auf Lager
Min.: 1
Mult.: 1
JUMPtec Computer-On-Module - COM JUMPtec COMe-mBTc10 E3815 1GB/2S 2Auf Lager
Min.: 1
Mult.: 1
congatec Entwicklungsplatinen & -kits - x86 EVALUATION CARRIER BRD COM EXP TYPE 10 1Auf Lager
Min.: 1
Mult.: 1

JUMPtec Wärmeableitungen HSP COMe-mBT10 through 5Auf Lager
Min.: 1
Mult.: 1
JUMPtec Computer-On-Module - COM JUMPtec COMe-mBTi10 E3815 1E/2S 1Auf Lager
Min.: 1
Mult.: 1
JUMPtec Computer-On-Module - COM JUMPtec COMe-mAL10 E2 E3930 4E Nicht-auf-Lager-Vorlaufzeit 49 Wochen
Min.: 1
Mult.: 1

JUMPtec Computer-On-Module - COM JUMPtec COMe-mAL10 E2 E3950 8E
29erwartet ab 17.03.2027
Min.: 1
Mult.: 1

JUMPtec Computer-On-Module - COM COMe-mRP10 E2 i7-1365URE 32GB
5erwartet ab 29.12.2026
Min.: 1
Mult.: 1

congatec Entwicklungsplatinen & -kits - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
77Auf Bestellung
Min.: 1
Mult.: 1