-ar Multiprotokoll-Module

Ergebnisse: 197
Auswählen Bild Teile-Nr.
 Herst.
Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – Mobilfunk, NBIoT, LTE
Protokoll – GPS, GLONASS
Protokoll – Sub-GHz
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Verpackung
Quectel Multiprotokoll-Module Cat M1 Only, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency)
Datenblatt
154Auf Lager
Min.: 1
Mult.: 1
Rolle: 250

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Multiprotokoll-Module Cat M1/Cat NB2/EGPRS, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency), Data ONLY!
Datenblatt
374Auf Lager
Min.: 1
Mult.: 1
Rolle: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Multiprotokoll-Module Cat M1/Cat NB2, Power Class 3 (23 dBm) + GNSS (w/o WWAN concurrency)
Datenblatt
240Auf Lager
Min.: 1
Mult.: 1
Rolle: 250

23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Multiprotokoll-Module Cat M1/Cat NB2/EGPRS, Power Class 3 (23 dBm) + GNSS (w/o WWAN concurrency)
Datenblatt
97Auf Lager
500erwartet ab 25.05.2026
Min.: 1
Mult.: 1
Rolle: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Multiprotokoll-Module Embedded, 0-6000, Cable assembly, 150mm, -, SMA-female to IPEX MHFI
Datenblatt
10Auf Lager
Min.: 1
Mult.: 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS
Quectel Multiprotokoll-Module Embedded, 1710-2700, 3300-5000, 5G, FPC with holder, -, Spring contact, Screw, 37.25 9.6 10.1
Datenblatt
1Auf Lager
Min.: 1
Mult.: 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Quectel Multiprotokoll-Module Embedded, 1559-1606, GNSS L1, Ceramic, -, -, Pin Mounting, 25 25 4
Datenblatt
2Auf Lager
Min.: 1
Mult.: 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1 BDS, Galileo, GLONASS, GPS
Fanstel Multiprotokoll-Module BLE 5.1 nRF52833 DF U.FL Connector
Datenblatt
2 704Auf Bestellung
Min.: 1
Mult.: 1
Rolle: 1 000

BM833 2.4 GHz 8 dBm I2C, I2S, SPI, UART 1.7 V 5.5 V - 40 C + 105 C u.FL 10.2 mm x 15 mm x 1.9 mm Bluetooth 5.1 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Quectel Multiprotokoll-Module Cat M1/Cat NB2/EGPRS + GNSS (w/o WWAN concurrency), no VoLTE
Datenblatt
84Auf Lager
Min.: 1
Mult.: 1
Rolle: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS Reel, Cut Tape
Texas Instruments Multiprotokoll-Module SimpleLink multipro tocol 2.4-GHz wirele
Datenblatt
3 992erwartet ab 06.07.2026
MouseReel verfügbar
Min.: 1
Mult.: 1
Rolle: 2 000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Embedded Artists Multiprotokoll-Module 2GF M.2 Module
Datenblatt
39Auf Bestellung
Min.: 1
Mult.: 1

2.4 GHz to 5 GHz 4-Wire UART, SDIO 3.15 V 3.46 V - 20 C + 70 C u.FL 802.11 a/b/g/n/ac Bulk
CEL Multiprotokoll-Module ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK
Datenblatt
3Auf Lager
Min.: 1
Mult.: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Quectel Multiprotokoll-Module Cat M1/Cat NB2, Power Class 5, 450 MHz Supported + GNSS (w/o WWAN concurrency)
Datenblatt
34Auf Lager
Min.: 1
Mult.: 1
Rolle: 250

26 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Ezurio Multiprotokoll-Module Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape (Infineon ARM Cortex 33 Airoc CYW55912)
Datenblatt
250erwartet ab 14.08.2026
Min.: 1
Mult.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Multiprotokoll-Module Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55913)
Datenblatt
250erwartet ab 20.08.2026
Min.: 1
Mult.: 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Multiprotokoll-Module Wi-Fi Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55912)
Datenblatt
250erwartet ab 14.08.2026
Min.: 1
Mult.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Microchip Technology Multiprotokoll-Module Bluetooth Low Energy/Zigbee Combo Module with PCB Antenna and extended temperature
Datenblatt
144erwartet ab 24.07.2026
Min.: 1
Mult.: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
Murata Electronics Multiprotokoll-Module Type 2FR module
Datenblatt
975erwartet ab 13.10.2026
Min.: 1
Mult.: 1
Rolle: 1 000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
Min.: 2 500
Mult.: 2 500
Rolle: 2 500

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Reel

Embedded Artists Multiprotokoll-Module 1LV M.2 Wi-Fi 4 a/b/g/n/ac, Bluetooth 5.0 with CYW43012 chipset and LBEE59B1LV
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 1 000
Mult.: 1

EA M.2 Modules 2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 20 C + 70 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Embedded Artists Multiprotokoll-Module 1XA M.2 Wi-Fi 5 a/b/g/n/ac MIMO, Bluetooth 5.2 with CYW54591 and LBEE5XV1XA
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 30 C + 85 C u.FL Bluetooth 5.1 802.11 a/b/g/n/ac Bulk
Silicon Labs Multiprotokoll-Module Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Chip 17.8 mm x 12.9 mm x 2.3 mm Bluetooth Thread, Zigbee Reel
Silicon Labs Multiprotokoll-Module Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 12 Wochen
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, UART 3.3 V 3.3 V - 40 C + 85 C 17.8 mm x 12.9 mm x 2.3 mm Cut Tape
Ezurio Multiprotokoll-Module Bluetooth Module, BL54L15 , Bluetooth LE, nRF54L15 chip, Trace Pin
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1
Mult.: 1
Rolle: 1 000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio Multiprotokoll-Module Bluetooth Module, BL54L15 , Bluetooth LE, nRF54L15 chip
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1
Mult.: 1
Rolle: 1 000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape