3M IC u. Komponentensockel

Ergebnisse: 745
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Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Produkt
Anzahl der Positionen
Anzahl der Zeilen
Typ
Abstand
Montage
Kontaktüberzug
Zeilenabstand
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Serie
Verpackung
3M Electronic Solutions Division IC u. Komponentensockel 20P PLCC SOCKET SMT W/O LOC POSTS
Datenblatt
3 738Auf Lager
Min.: 1
Mult.: 1

PLCC Sockets 20 Position 4 Row Chip Carrier 1.27 mm Solder Pad Tin 5.08 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC u. Komponentensockel 28P PLCC SOCKET THRU-HOLE
Datenblatt
1 438Auf Lager
Min.: 1
Mult.: 1

PLCC Sockets 28 Position 4 Row Chip Carrier 1.27 mm Solder Tail Tin 7.62 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC u. Komponentensockel Textool QFN .4MM,56P EVEN ROW,W/THRML PI
Datenblatt
19Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 56 Position QFN Socket 0.4 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel 44P PLCC SOCKET THRU-HOLE
Datenblatt
5 751Auf Lager
Min.: 1
Mult.: 1

PLCC Sockets 44 Position 4 Row Chip Carrier 1.27 mm Solder Tail Tin 12.7 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC u. Komponentensockel 18P DUAL WIPE DIPSKT
Datenblatt
7 632Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 18 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 5 CON STR BRDMNT SKT
Datenblatt
1 339Auf Lager
Min.: 1
Mult.: 1

Headers 5 Position 1 Row Socket 2.54 mm (0.1 in) Solder Pin Tin - 40 C + 105 C 929 Each
3M Electronic Solutions Division IC u. Komponentensockel 24P DUAL WIPE DIPSKT
Datenblatt
3 647Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 24 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel BURN-IN SOIC SOCKET 18 Leads
Datenblatt
52Auf Lager
Min.: 1
Mult.: 1

18 Position Solder Tail Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel 0.100" DIP SOCKET 16 Contact Qty.
Datenblatt
132Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 16 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 7.62 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel 20P DUAL WIPE DIPSKT
Datenblatt
8 111Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 20 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel SOCKET 28POS .3" IC OPEN FRAME
Datenblatt
4 999Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 28 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 18P DUAL WIPE DIPSKT
Datenblatt
6 505Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 18 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 0.070" DIP SOCKET 32 Contact Qty.
Datenblatt
12Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 32 Position 2 Row DIP Socket 1.78 mm Solder Pin Gold 15.24 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel 68P PLCC SOCKET SMT W/O LOC POSTS
Datenblatt
1 241Auf Lager
Min.: 1
Mult.: 1

PLCC Sockets 68 Position 4 Row Chip Carrier 1.27 mm Solder Pad Tin 20.32 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC u. Komponentensockel 84P PLCC SOCKET SMT W/LOCATION POSTS
Datenblatt
998Auf Lager
Min.: 1
Mult.: 1

PLCC Sockets 84 Position 4 Row Chip Carrier 1.27 mm Solder Pad Tin 25.4 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC u. Komponentensockel 32P PLCC SOCKET SMT W/LOCATION POSTS
Datenblatt
1 389Auf Lager
Min.: 1
Mult.: 1

PLCC Sockets 32 Position 4 Row Chip Carrier 1.27 mm Solder Pad Tin 10.16 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC u. Komponentensockel RECPT FOR DIP SOCKET 28 Contact Qty.
Datenblatt
39Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 28 Position 2.54 mm Through Hole Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel 24P DUAL WIPE DIPSKT
Datenblatt
2 936Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 24 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel RECPT FOR DIP SOCKET 64 Contact Qty.
Datenblatt
7Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 64 Position 2 Row DIP Socket 1.78 mm Solder Pin Gold 20.32 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel RECPT FOR DIP SOCKET 28 Contact Qty.
Datenblatt
10Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel RECPT FOR DIP SOCKET 42 Contact Qty.
Datenblatt
11Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 42 Position 2 Row DIP Socket 1.78 mm Solder Pin Gold 15.24 mm - 55 C + 125 C
3M Electronic Solutions Division IC u. Komponentensockel RECPT FOR DIP SOCKET 28 Contact Qty.
Datenblatt
7Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 10.16 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel RECPT FOR DIP SOCKET 40 Contact Qty.
Datenblatt
13Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 40 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 25.4 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel RECPT FOR DIP SOCKET 42 Contact Qty.
Datenblatt
2Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 42 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C
3M Electronic Solutions Division IC u. Komponentensockel Textool QFN .5MM,40P EVEN RW,W/O THRML PN
Datenblatt
16Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 40 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each