1.25mm Small Form Factor HPI Serie Sockel & Kabelgehäuse

Ergebnisse: 75
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Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Produkt
Anzahl der Positionen
Abstand
Anzahl der Zeilen
Montageart
Montage
Montagewinkel
Kontakt-Gender
Kontaktüberzug
Serie
Anwendung
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Verpackung
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, BOARD LOCK,GOLD, 2POS
Datenblatt
9 555Auf Lager
Min.: 1
Mult.: 1
Rolle: 800

Headers 2 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel, Cut Tape
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, BOARD LOCK,GOLD, 3POS
Datenblatt
7 200Auf Lager
Min.: 1
Mult.: 1
Rolle: 800

Headers 3 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel, Cut Tape
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, BOARD LOCK,GOLD, 4POS
Datenblatt
7 200Auf Lager
Min.: 1
Mult.: 1
Rolle: 800

Headers 4 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel, Cut Tape
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, BOARD LOCK,GOLD, 5POS
Datenblatt
7 200Auf Lager
Min.: 1
Mult.: 1
Rolle: 800

Headers 5 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel, Cut Tape
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, BOARD LOCK,GOLD, 6POS
Datenblatt
7 200Auf Lager
Min.: 1
Mult.: 1
Rolle: 800

Headers 6 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel, Cut Tape
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, BOARD LOCK,GOLD, 8POS
Datenblatt
7 200Auf Lager
Min.: 1
Mult.: 1
Rolle: 800

Headers 8 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel, Cut Tape
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, BOARD LOCK,GOLD, 10POS
Datenblatt
4 800Auf Lager
Min.: 1
Mult.: 1
Rolle: 800

Headers 10 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel, Cut Tape
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HSG , BOARD LOCK, 10POS
Datenblatt
6 997Auf Lager
Min.: 1
Mult.: 1

Wire Housings 10 Position 1.25 mm (0.049 in) PCB Mount Crimp Straight 1.25mm Small Form Factor HPI Power - 40 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HSG , BOARD LOCK, 12POS
Datenblatt
5 000Auf Lager
Min.: 1
Mult.: 1

Wire Housings 12 Position 1.25 mm (0.049 in) PCB Mount Crimp Straight 1.25mm Small Form Factor HPI Power - 40 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HSG , BOARD LOCK, 7POS
Datenblatt
10 000Auf Lager
Min.: 1
Mult.: 1

Wire Housings 7 Position 1.25 mm (0.049 in) PCB Mount Crimp Straight 1.25mm Small Form Factor HPI Power - 40 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HSG , BOARD LOCK, 8POS
Datenblatt
7 995Auf Lager
Min.: 1
Mult.: 1

Wire Housings 8 Position 1.25 mm (0.049 in) PCB Mount Crimp Straight 1.25mm Small Form Factor HPI Power - 40 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, W/O BOARD LOCK,TIN, 11POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 6 000
Mult.: 6 000
Rolle: 1 000

Headers 11 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, W/O BOARD LOCK,TIN, 13POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 6 000
Mult.: 6 000
Rolle: 1 000

Headers 13 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, W/O BOARD LOCK,TIN, 14POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 6 000
Mult.: 6 000
Rolle: 1 000

Headers 14 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, W/O BOARD LOCK,TIN, 15POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 6 000
Mult.: 6 000
Rolle: 1 000

Headers 15 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, W/O BOARD LOCK,TIN, 16POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 6 000
Mult.: 6 000
Rolle: 1 000

Headers 16 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HSG , BOARD LOCK, 11POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 6 000
Mult.: 6 000

Wire Housings 11 Position 1.25 mm (0.049 in) PCB Mount Crimp Straight 1.25mm Small Form Factor HPI Power - 40 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HSG , BOARD LOCK, 13POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 7 200
Mult.: 3 600

Wire Housings 13 Position 1.25 mm (0.049 in) PCB Mount Crimp Straight 1.25mm Small Form Factor HPI Power - 40 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HSG , BOARD LOCK, 14POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 7 200
Mult.: 3 600

Wire Housings 14 Position 1.25 mm (0.049 in) PCB Mount Crimp Straight 1.25mm Small Form Factor HPI Power - 40 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HSG , BOARD LOCK, 15POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 6 400
Mult.: 3 200

Wire Housings 15 Position 1.25 mm (0.049 in) PCB Mount Crimp Straight 1.25mm Small Form Factor HPI Power - 40 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HSG , BOARD LOCK, 16POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 6 400
Mult.: 3 200

Wire Housings 16 Position 1.25 mm (0.049 in) PCB Mount Crimp Straight 1.25mm Small Form Factor HPI Power - 40 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, BOARD LOCK,TIN, 7POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 7 200
Mult.: 7 200
Rolle: 800

Headers 7 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, BOARD LOCK,TIN, 9POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 7 200
Mult.: 7 200
Rolle: 800

Headers 9 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, W/O BOARD LOCK,TIN, 7POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 9 000
Mult.: 9 000
Rolle: 1 000

Headers 7 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel
TE Connectivity Sockel & Kabelgehäuse 1.25mm Small Form Factor HPI HDR SMT, W/O BOARD LOCK,TIN, 9POS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 9 000
Mult.: 9 000
Rolle: 1 000

Headers 9 Position 1.25 mm (0.049 in) 1 Row PCB Mount Solder Straight Pin (Male) Tin 1.25mm Small Form Factor HPI - 40 C + 125 C Reel