5569 Serie Sockel & Kabelgehäuse

Ergebnisse: 152
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Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Produkt
Typ
Anzahl der Positionen
Abstand
Anzahl der Zeilen
Zeilenabstand
Montageart
Montage
Montagewinkel
Kontakt-Gender
Kontaktüberzug
Länge des Abschlussstiftes
Serie
Handelsname
Anwendung
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Verpackung
Molex Sockel & Kabelgehäuse 24 CKT R/A HEADER
Datenblatt
104Auf Lager
300erwartet ab 19.06.2026
Min.: 1
Mult.: 1

Headers Power 24 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse MiniFitJr Hdr RA 2P W/PCBMnt Flg .76umAu
Datenblatt
32Auf Lager
1 720erwartet ab 21.04.2026
Min.: 1
Mult.: 1

Headers Power 2 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse NEW MINI FIT CONN W MINI FIT CONN ASSY
Datenblatt
5Auf Lager
Min.: 1
Mult.: 1

Headers Power 6 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse MiniFit Jr RA DR /Fl /Flgs 30Au V-0 10Ck
Datenblatt
214Auf Lager
Min.: 1
Mult.: 1

Headers Power 10 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Mounting Flange Solder Pin Right Angle Pin (Male) Gold 3.5 mm (0.138 in) 5569 Mini-Fit Jr. - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse MiniFit Jr RA DR /Fl /Flgs 30Au V-0 12Ckt
Datenblatt
42Auf Lager
Min.: 1
Mult.: 1

Headers Power 12 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse 2 CKT R/A HEADER
Datenblatt
489Auf Lager
4 800erwartet ab 16.03.2026
Min.: 1
Mult.: 1

Headers Power 2 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse 8 CKT R/A HEADER
Datenblatt
401Auf Lager
Min.: 1
Mult.: 1

Headers Power 8 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Tray
Molex Sockel & Kabelgehäuse MINI-FIT JR. HEADER
Datenblatt
133Auf Lager
Min.: 1
Mult.: 1

Headers Power 16 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse 20 CKT R/A HEADER
Datenblatt
197Auf Lager
Min.: 1
Mult.: 1

Headers Power 20 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse MINI-FIT JR. HEADER
Datenblatt
46Auf Lager
Min.: 1
Mult.: 1

Headers Power 22 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse 24CKT RA DR HDR
Datenblatt
386Auf Lager
6 000erwartet ab 20.07.2026
Min.: 1
Mult.: 1

Headers Power 24 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse 12 CKT R/A HEADER
Datenblatt
569Auf Lager
2 883Auf Bestellung
Min.: 1
Mult.: 1

Headers Power 12 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.6 mm (0.142 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse MiniFit JrRA DR/Pegs Tin V-0 4Ckt Tray
Datenblatt
1 671Auf Lager
Min.: 1
Mult.: 1

Headers Shrouded 4 Position 4.2 mm (0.165 in) 2 Row Through Hole Solder Pin Pin (Male) Tin 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C
Molex Sockel & Kabelgehäuse MiniFit JrRA DR/Pegs Tin V-0 8Ckt Tray
Datenblatt
1 231Auf Lager
Min.: 1
Mult.: 1

Headers Shrouded 8 Position 4.2 mm (0.165 in) 2 Row Through Hole Solder Pin Pin (Male) Gold 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C
Molex Sockel & Kabelgehäuse MiniFit JrRADR/Pegs Tin V-0 10Ckt Tray
Datenblatt
885Auf Lager
Min.: 1
Mult.: 1

Headers Shrouded 10 Position 4.2 mm (0.165 in) 2 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C


Molex Sockel & Kabelgehäuse MiniFitJr RA DR Peg Tin V2 16Ckt
Datenblatt
397Auf Lager
Min.: 1
Mult.: 1

Headers Shrouded 16 Position 4.2 mm (0.165 in) 2 Row Through Hole Solder Pin Right Angle Pin (Male) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C
Molex Sockel & Kabelgehäuse 20 CKT R/A HEADER
Datenblatt
8Auf Lager
Min.: 1
Mult.: 1

Headers Power 20 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.6 mm (0.142 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse MiniFit Jr RA SR Peg Tin V-2 5Ckt
Datenblatt
772Auf Lager
Min.: 1
Mult.: 1

Headers Shrouded 5 Position 4.2 mm (0.165 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Nickel 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse MiniFitJr RA DRPegs 30Au V0 14CktTray
Datenblatt
47Auf Lager
Min.: 1
Mult.: 1

Headers Shrouded 14 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.6 mm (0.142 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C
Molex Sockel & Kabelgehäuse 3 CKT R/A HEADER
Datenblatt
43 306erwartet ab 02.06.2026
Min.: 1
Mult.: 1

Headers Power 3 Position 4.2 mm (0.165 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse 8 CKT R/A HEADER
Datenblatt
19 532erwartet ab 27.04.2026
Min.: 1
Mult.: 1

Headers Power 8 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse HOUSING ASSEMBLY
Datenblatt
1 199erwartet ab 14.04.2026
Min.: 1
Mult.: 1

Headers Power 10 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse 18 CKT R/A HEADER
Datenblatt
2 200erwartet ab 12.05.2026
Min.: 1
Mult.: 1

Headers Power 18 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 3.6 mm (0.142 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse 20 CKT R/A HEADER
Datenblatt
5 448erwartet ab 26.05.2026
Min.: 1
Mult.: 1

Headers Power 20 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 3.6 mm (0.142 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk
Molex Sockel & Kabelgehäuse HDR RA DUAL 12P
Datenblatt
1 200erwartet ab 21.04.2026
Min.: 1
Mult.: 1

Headers Power 12 Position 4.2 mm (0.165 in) 2 Row 4.2 mm (0.165 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 5569 Mini-Fit Jr. Wire-to-Board, Power - 40 C + 105 C Bulk