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|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-08-2-K-TR
- Samtec
-
1:
11.43 CHF
-
Nicht-auf-Lager-Vorlaufzeit 52 Wochen
|
Mouser-Teilenr.
200-LPAM10010L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 52 Wochen
|
|
|
11.43 CHF
|
|
|
10.93 CHF
|
|
|
10.51 CHF
|
|
|
9.75 CHF
|
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|
7.12 CHF
|
|
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Anzeigen
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8.36 CHF
|
|
|
7.12 CHF
|
|
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6.94 CHF
|
|
Min.: 1
Mult.: 1
|
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LPAM
|
Reel, Cut Tape
|
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Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-04-2-K-TR
- Samtec
-
625:
4.95 CHF
-
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
|
Mouser-Teilenr.
200-LPAM10010S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
|
|
|
4.95 CHF
|
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|
4.81 CHF
|
|
Min.: 625
Mult.: 625
|
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LPAM
|
Reel
|
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|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-1-K-TR
- Samtec
-
400:
6.90 CHF
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM10010S061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
|
6.90 CHF
|
|
|
6.56 CHF
|
|
Min.: 400
Mult.: 400
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-2-K-TR
- Samtec
-
400:
6.90 CHF
-
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
|
Mouser-Teilenr.
200-LPAM10010S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
|
|
|
6.90 CHF
|
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|
6.56 CHF
|
|
Min.: 400
Mult.: 400
|
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LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-1-K-TR
- Samtec
-
575:
4.79 CHF
-
Nicht-auf-Lager-Vorlaufzeit 49 Wochen
|
Mouser-Teilenr.
200-LPAM10015L041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 49 Wochen
|
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|
4.79 CHF
|
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|
4.68 CHF
|
|
Min.: 575
Mult.: 575
|
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LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-2-K-TR
- Samtec
-
575:
4.79 CHF
-
Nicht-auf-Lager-Vorlaufzeit 49 Wochen
|
Mouser-Teilenr.
200-LPAM10015L042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 49 Wochen
|
|
|
4.79 CHF
|
|
|
4.68 CHF
|
|
Min.: 575
Mult.: 575
|
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LPAM
|
Reel
|
|
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|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-06-1-K-TR
- Samtec
-
375:
6.70 CHF
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
Mouser-Teilenr.
200-LPAM10015L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
|
6.70 CHF
|
|
|
6.36 CHF
|
|
Min.: 375
Mult.: 375
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-06-2-K-TR
- Samtec
-
375:
6.70 CHF
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
Mouser-Teilenr.
200-LPAM10015L062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
|
6.70 CHF
|
|
|
6.36 CHF
|
|
Min.: 375
Mult.: 375
|
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LPAM
|
Reel
|
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|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-04-2-K-TR
- Samtec
-
575:
5.03 CHF
-
Nicht-auf-Lager-Vorlaufzeit 49 Wochen
|
Mouser-Teilenr.
200-LPAM10015S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 49 Wochen
|
|
|
5.03 CHF
|
|
|
4.91 CHF
|
|
Min.: 575
Mult.: 575
|
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LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-06-2-K-TR
- Samtec
-
375:
7.04 CHF
-
Nicht-auf-Lager-Vorlaufzeit 21 Wochen
|
Mouser-Teilenr.
200-LPAM10015S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 21 Wochen
|
|
|
7.04 CHF
|
|
|
6.68 CHF
|
|
Min.: 375
Mult.: 375
|
|
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|
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LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-06-1-K-TR
- Samtec
-
325:
7.71 CHF
-
Nicht-auf-Lager-Vorlaufzeit 50 Wochen
|
Mouser-Teilenr.
200-LPAM20010L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 50 Wochen
|
|
|
7.71 CHF
|
|
|
7.52 CHF
|
|
Min.: 325
Mult.: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-2-K-TR
- Samtec
-
300:
9.83 CHF
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAM20010L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
|
9.83 CHF
|
|
|
9.59 CHF
|
|
Min.: 300
Mult.: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-04-2-K-TR
- Samtec
-
475:
6.82 CHF
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM20010S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
|
6.82 CHF
|
|
|
6.65 CHF
|
|
Min.: 475
Mult.: 475
|
|
|
|
|
|
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|
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|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-06-2-K-TR
- Samtec
-
325:
8.11 CHF
-
Nicht-auf-Lager-Vorlaufzeit 50 Wochen
|
Mouser-Teilenr.
200-LPAM20010S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 50 Wochen
|
|
|
8.11 CHF
|
|
|
7.91 CHF
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
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|
|
|
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|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-2-K-TR
- Samtec
-
300:
10.34 CHF
-
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
|
Mouser-Teilenr.
200-LPAM20010S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
|
|
|
10.34 CHF
|
|
|
10.09 CHF
|
|
Min.: 300
Mult.: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-20-01.5-L-08-2-K-TR
- Samtec
-
300:
10.04 CHF
-
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
|
Mouser-Teilenr.
200-LPAM20015L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM LP ARRAY HS HD LOW PRO
|
|
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
|
|
|
10.04 CHF
|
|
|
9.80 CHF
|
|
Min.: 300
Mult.: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-04-1-K-TR
- Samtec
-
450:
6.95 CHF
-
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
|
Mouser-Teilenr.
200-LPAM20015S041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
|
|
|
6.95 CHF
|
|
|
6.78 CHF
|
|
Min.: 450
Mult.: 450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-04-2-K-TR
- Samtec
-
450:
6.95 CHF
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM20015S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
|
6.95 CHF
|
|
|
6.78 CHF
|
|
Min.: 450
Mult.: 450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-06-1-K-TR
- Samtec
-
300:
8.27 CHF
-
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
|
Mouser-Teilenr.
200-LPAM20015S061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
|
|
|
8.27 CHF
|
|
|
8.07 CHF
|
|
Min.: 300
Mult.: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-06-2-K-TR
- Samtec
-
300:
8.27 CHF
-
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
|
Mouser-Teilenr.
200-LPAM20015S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
|
|
|
8.27 CHF
|
|
|
8.07 CHF
|
|
Min.: 300
Mult.: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-1-K-TR
- Samtec
-
300:
10.55 CHF
-
Nicht-auf-Lager-Vorlaufzeit 26 Wochen
|
Mouser-Teilenr.
200-LPAM20015S081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 26 Wochen
|
|
|
10.55 CHF
|
|
|
10.28 CHF
|
|
Min.: 300
Mult.: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-1-K-TR
- Samtec
-
325:
9.18 CHF
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM30010L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
|
9.18 CHF
|
|
|
8.94 CHF
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-08-1-K-TR
- Samtec
-
325:
11.70 CHF
-
Nicht-auf-Lager-Vorlaufzeit 50 Wochen
|
Mouser-Teilenr.
200-LPAM30010L081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 50 Wochen
|
|
|
11.70 CHF
|
|
|
11.40 CHF
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-04-2-K-TR
- Samtec
-
475:
8.11 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM30010S042KTR
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Samtec
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Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
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Nicht-auf-Lager-Vorlaufzeit 14 Wochen
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8.11 CHF
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7.91 CHF
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Min.: 475
Mult.: 475
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LPAM
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Reel
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Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-06-2-K-TR
- Samtec
-
325:
9.65 CHF
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM30010S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
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9.65 CHF
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9.40 CHF
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Min.: 325
Mult.: 325
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LPAM
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Reel
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