|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.0-L-05-1-A-K-TR
- Samtec
-
325:
7.37 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF20060L051AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
7.37 CHF
|
|
|
6.99 CHF
|
|
Min.: 325
Mult.: 325
|
Nein
|
|
Headers
|
100 Position
|
1.27 mm (0.05 in)
|
5 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.0-L-06-1-A-K-TR
- Samtec
-
325:
6.56 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF20060L061AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
6.56 CHF
|
|
|
6.40 CHF
|
|
Min.: 325
Mult.: 325
|
Nein
|
|
Headers
|
120 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.0-L-08-1-A-K-TR
- Samtec
-
225:
9.83 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF20060L081AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
9.83 CHF
|
|
|
9.32 CHF
|
|
Min.: 225
Mult.: 225
|
Nein
|
|
Headers
|
160 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.0-L-10-1-A-K-TR
- Samtec
-
225:
11.16 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF20060L101AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
11.16 CHF
|
|
|
10.60 CHF
|
|
Min.: 225
Mult.: 225
|
Nein
|
|
Headers
|
200 Position
|
1.27 mm (0.05 in)
|
10 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.0-S-05-1-A-K-TR
- Samtec
-
325:
6.91 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF20060S051AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
6.91 CHF
|
|
|
6.74 CHF
|
|
Min.: 325
Mult.: 325
|
Nein
|
|
Headers
|
100 Position
|
1.27 mm (0.05 in)
|
5 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.0-S-08-1-A-K-TR
- Samtec
-
225:
10.82 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF20060S081AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
10.82 CHF
|
|
|
10.26 CHF
|
|
Min.: 225
Mult.: 225
|
Nein
|
|
Headers
|
160 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.0-S-10-1-A-K-TR
- Samtec
-
225:
12.29 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF20060S101AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
12.29 CHF
|
|
|
11.67 CHF
|
|
Min.: 225
Mult.: 225
|
Nein
|
|
Headers
|
200 Position
|
1.27 mm (0.05 in)
|
10 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.5-L-05-1-A-K-TR
- Samtec
-
200:
7.37 CHF
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
Mouser-Teilenr.
200-EAF20065L051AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
|
7.37 CHF
|
|
|
6.99 CHF
|
|
Min.: 200
Mult.: 200
|
Nein
|
|
Headers
|
100 Position
|
1.27 mm (0.05 in)
|
5 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.5-L-06-1-A-K-TR
- Samtec
-
200:
7.71 CHF
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-EAF20065L061AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
|
7.71 CHF
|
|
|
7.31 CHF
|
|
Min.: 200
Mult.: 200
|
Nein
|
|
Headers
|
120 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.5-L-10-1-A-K-TR
- Samtec
-
200:
11.16 CHF
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-EAF20065L101AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
|
11.16 CHF
|
|
|
10.60 CHF
|
|
Min.: 200
Mult.: 200
|
Nein
|
|
Headers
|
200 Position
|
1.27 mm (0.05 in)
|
10 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.5-S-05-1-A-K-TR
- Samtec
-
200:
8.12 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF20065S051AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
8.12 CHF
|
|
|
7.71 CHF
|
|
Min.: 200
Mult.: 200
|
Nein
|
|
Headers
|
100 Position
|
1.27 mm (0.05 in)
|
5 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.5-S-08-1-A-K-TR
- Samtec
-
200:
10.82 CHF
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-EAF20065S081AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
|
10.82 CHF
|
|
|
10.26 CHF
|
|
Min.: 200
Mult.: 200
|
Nein
|
|
Headers
|
160 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-20-06.5-S-10-1-A-K-TR
- Samtec
-
200:
12.29 CHF
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-EAF20065S101AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
|
12.29 CHF
|
|
|
11.67 CHF
|
|
Min.: 200
Mult.: 200
|
Nein
|
|
Headers
|
200 Position
|
1.27 mm (0.05 in)
|
10 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-25-06.5-S-04-1-A-K-TR
- Samtec
-
325:
6.91 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF25065S041AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
6.91 CHF
|
|
|
6.74 CHF
|
|
Min.: 325
Mult.: 325
|
Nein
|
|
Headers
|
100 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-30-05.0-L-04-1-A-K-TR
- Samtec
-
375:
7.23 CHF
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-EAF30050L041AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
|
7.23 CHF
|
|
|
6.85 CHF
|
|
Min.: 375
Mult.: 375
|
Nein
|
|
Headers
|
120 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-30-05.0-L-05-1-A-K-TR
- Samtec
-
375:
6.99 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF30050L051AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
6.99 CHF
|
|
|
6.82 CHF
|
|
Min.: 375
Mult.: 375
|
Nein
|
|
Headers
|
150 Position
|
1.27 mm (0.05 in)
|
5 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-30-05.0-L-08-1-A-K-TR
- Samtec
-
250:
9.33 CHF
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
Mouser-Teilenr.
200-EAF30050L081AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
|
9.33 CHF
|
|
|
9.09 CHF
|
|
Min.: 250
Mult.: 250
|
Nein
|
|
Headers
|
240 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-30-05.0-L-10-1-A-K-TR
- Samtec
-
250:
10.60 CHF
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
Mouser-Teilenr.
200-EAF30050L101AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
|
10.60 CHF
|
|
|
10.32 CHF
|
|
Min.: 250
Mult.: 250
|
Nein
|
|
Headers
|
300 Position
|
1.27 mm (0.05 in)
|
10 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-30-06.0-L-04-1-A-K-TR
- Samtec
-
325:
6.56 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF30060L041AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
6.56 CHF
|
|
|
6.40 CHF
|
|
Min.: 325
Mult.: 325
|
Nein
|
|
Headers
|
120 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-30-06.0-L-06-1-A-K-TR
- Samtec
-
225:
9.17 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF30060L061AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
9.17 CHF
|
|
|
8.69 CHF
|
|
Min.: 225
Mult.: 225
|
Nein
|
|
Headers
|
180 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-30-06.0-L-08-1-A-K-TR
- Samtec
-
225:
11.68 CHF
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
Mouser-Teilenr.
200-EAF30060L081AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
|
11.68 CHF
|
|
|
11.09 CHF
|
|
Min.: 225
Mult.: 225
|
Nein
|
|
Headers
|
240 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-30-06.0-L-10-1-A-K-TR
- Samtec
-
225:
13.28 CHF
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
Mouser-Teilenr.
200-EAF30060L101AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
|
13.28 CHF
|
|
|
12.60 CHF
|
|
Min.: 225
Mult.: 225
|
Nein
|
|
Headers
|
300 Position
|
1.27 mm (0.05 in)
|
10 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-30-06.0-S-05-1-A-K-TR
- Samtec
-
225:
9.66 CHF
-
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
|
Mouser-Teilenr.
200-EAF30060S051AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
|
|
|
9.66 CHF
|
|
|
9.16 CHF
|
|
Min.: 225
Mult.: 225
|
Nein
|
|
Headers
|
150 Position
|
1.27 mm (0.05 in)
|
5 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-30-06.0-S-08-1-A-K-TR
- Samtec
-
225:
12.88 CHF
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
Mouser-Teilenr.
200-EAF30060S081AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
|
12.88 CHF
|
|
|
12.21 CHF
|
|
Min.: 225
Mult.: 225
|
Nein
|
|
Headers
|
240 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
- SEAF-30-06.0-S-10-1-A-K-TR
- Samtec
-
225:
14.63 CHF
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-EAF30060S101AKTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
14.63 CHF
|
|
|
13.88 CHF
|
|
Min.: 225
Mult.: 225
|
Nein
|
|
Headers
|
300 Position
|
1.27 mm (0.05 in)
|
10 Row
|
Solder
|
Straight
|
7 mm
|
2.7 A
|
240 VAC
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
SEAF
|
Reel
|
|