5G Automotive- und Transportlösungen

Die 5G-Konnektivität für Automotive- und Transportlösungen von Samtec erfüllt die Anforderungen des wachsenden 5G-Netzwerkmarktes. Da die Implementierung des 5G-Netzwerks schnell an Dynamik gewinnt, werden neue Hochleistungsbauteile, Systeme sowie Prüf- und Messgeräte benötigt, um die extrem hohen Frequenzen und hohen Datenraten zu unterstützen, die Technologien wie mmWave, Massive MIMO, Strahlformung und Vollduplex-Anforderungen erfordern. Samtec bietet Hochleistungsverbindungen zusammen mit hohem technischem Know-how zur Unterstützung dieser Anforderungen, einschließlich eines wachsenden Portfolios von Lösungen, die sich hervorragend für Fahrzeuganwendungen eignen.

Ergebnisse: 4 277
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Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Produkt
Anzahl der Positionen
Abstand
Anzahl der Zeilen
Montage
Montagewinkel
Stackhöhe
Nennstrom
Nennspannung
Maximale Datenrate
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Kontaktüberzug
Kontaktmaterial
Gehäusematerial
Serie
Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
61Auf Lager
Min.: 1
Mult.: 1
: 200

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
247Auf Lager
Min.: 1
Mult.: 1
: 300

Connectors 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
166Auf Lager
Min.: 1
Mult.: 1
: 100

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80MM Q STRIP HS GP SOCKET
Datenblatt
346Auf Lager
Min.: 1
Mult.: 1
: 350

Connectors 120 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
1 608Auf Lager
Min.: 1
Mult.: 1

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 5 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
589Auf Lager
Min.: 1
Mult.: 1

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 8 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
214Auf Lager
Min.: 1
Mult.: 1
: 325

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
600Auf Lager
Min.: 1
Mult.: 1
: 200

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
413Auf Lager
Min.: 1
Mult.: 1
: 200

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
129Auf Lager
Min.: 1
Mult.: 1
: 75

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
468Auf Lager
Min.: 1
Mult.: 1
: 400

Headers 40 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Q Strip High-Speed Ground Plane Socket Strip
Datenblatt
461Auf Lager
Min.: 1
Mult.: 1
: 475

Sockets 100 Position 0.635 mm (0.025 in) 2 Row Solder Straight 1.8 A 285 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSS Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Q Strip High-Speed Ground Plane Socket Strip
Datenblatt
417Auf Lager
Min.: 1
Mult.: 1
: 475

Sockets 150 Position 0.635 mm (0.025 in) 2 Row Solder Straight 1.8 A 285 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSS Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header
Datenblatt
199Auf Lager
Min.: 1
Mult.: 1

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Straight 5 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
606Auf Lager
Min.: 1
Mult.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 11 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
572Auf Lager
Min.: 1
Mult.: 1
: 200

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
147Auf Lager
Min.: 1
Mult.: 1
: 325

Sockets 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
605Auf Lager
Min.: 1
Mult.: 1
: 250

Sockets 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
176Auf Lager
Min.: 1
Mult.: 1
: 325

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
138Auf Lager
Min.: 1
Mult.: 1
: 325

Sockets 300 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
281Auf Lager
Min.: 1
Mult.: 1
: 125

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
362Auf Lager
Min.: 1
Mult.: 1
: 75

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
221Auf Lager
Min.: 1
Mult.: 1
: 350

Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Datenblatt
240Auf Lager
Min.: 1
Mult.: 1
: 500
Sockets 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Datenblatt
86Auf Lager
Min.: 1
Mult.: 1

Sockets 180 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray