Ergebnisse: 12
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Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – WLAN – 802.11
Verpackung
NXP Semiconductors Multiprotokoll-Module IW610GHN/A1ZDI
Datenblatt
1 240Auf Lager
Min.: 1
Mult.: 1

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors Multiprotokoll-Module IW610BHN/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Multiprotokoll-Module IW610BUK/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2 000

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610CHN/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors Multiprotokoll-Module IW610CUK/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2 000

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610FHN/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2 700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610FUK/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2 000

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610GUK/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2 000

IW610GUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610BHN/A1ZDI
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 2 700
Mult.: 2 700
: 2 700

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel
NXP Semiconductors Multiprotokoll-Module IW610CHN/A1ZDI
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 2 700
Mult.: 2 700
: 2 700

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel
NXP Semiconductors Multiprotokoll-Module IW610FHN/A1ZDI
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1 300
Mult.: 1 300

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Multiprotokoll-Module IW610GHN/A1ZDI
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1
Mult.: 1
: 2 700

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape