SEARAY™ SEAF High-Density Socket Connectors

Samtec SEARAY™ SEAF High-Density Socket Connectors feature 7mm to 40mm stack heights and up to 56Gbps performance rating. The SEAF series includes the SEAF-RA right-angle socket, the SEAF8 0.8mm open-pin-field array, the SEAFP press-fit socket, and the SEAFP-RA right-angle press-fit socket. SEAF socket connectors offer a solder on each tail for ease of processing and up to 560 single-ended I/Os or 140 differential pairs. Samtec SEARAY SEAF High-Density Socket Connectors are ideal for parallel, perpendicular, and coplanar applications. 

Ergebnisse: 613
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Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Produkt
Anzahl der Positionen
Abstand
Anzahl der Zeilen
Montage
Montagewinkel
Stackhöhe
Nennstrom
Nennspannung
Maximale Datenrate
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Kontaktüberzug
Kontaktmaterial
Gehäusematerial
Serie
Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 200
Mult.: 200
Rolle: 200
Nein
Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 325
Mult.: 325
Rolle: 325
Nein
Headers 100 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 175
Mult.: 175
Rolle: 175
Nein
Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 100
Mult.: 100
Rolle: 100
Nein
Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 75
Mult.: 75
Rolle: 75
Nein
Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 9 Wochen
Min.: 1
Mult.: 1
Rolle: 175
Nein
Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 375
Mult.: 375
Rolle: 375
Nein
Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 375
Mult.: 375
Rolle: 375
Nein
Headers 150 Position 1.27 mm (0.05 in) 5 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 1
Mult.: 1
Rolle: 250
Nein
Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 250
Mult.: 250
Rolle: 250
Nein
Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 325
Mult.: 325
Rolle: 325
Nein
Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 225
Mult.: 225
Rolle: 225
Nein
Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 225
Mult.: 225
Rolle: 225
Nein
Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 225
Mult.: 225
Rolle: 225
Nein
Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
Min.: 225
Mult.: 225
Rolle: 225
Nein
Headers 150 Position 1.27 mm (0.05 in) 5 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 225
Mult.: 225
Rolle: 225
Nein
Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 225
Mult.: 225
Rolle: 225
Nein
Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 325
Mult.: 325
Rolle: 325
Nein
Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 200
Mult.: 200
Rolle: 200
Nein
Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
Min.: 200
Mult.: 200
Rolle: 200
Nein
Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 1
Mult.: 1
Rolle: 200
Nein
Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 275
Mult.: 275
Rolle: 275
Nein
Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 100
Mult.: 100
Rolle: 100
Nein
Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 375
Mult.: 375
Rolle: 375
Nein
Headers 200 Position 1.27 mm (0.05 in) 5 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 225
Mult.: 225
Rolle: 225
Nein
Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel