SEARAY™ SEAF High-Density Socket Connectors

Samtec SEARAY™ SEAF High-Density Socket Connectors feature 7mm to 40mm stack heights and up to 56Gbps performance rating. The SEAF series includes the SEAF-RA right-angle socket, the SEAF8 0.8mm open-pin-field array, the SEAFP press-fit socket, and the SEAFP-RA right-angle press-fit socket. SEAF socket connectors offer a solder on each tail for ease of processing and up to 560 single-ended I/Os or 140 differential pairs. Samtec SEARAY SEAF High-Density Socket Connectors are ideal for parallel, perpendicular, and coplanar applications. 

Ergebnisse: 613
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Menge RoHS ECAD Model Produkt
Anzahl der Positionen
Abstand
Anzahl der Zeilen
Montage
Montagewinkel
Stackhöhe
Nennstrom
Nennspannung
Maximale Datenrate
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Kontaktüberzug
Kontaktmaterial
Gehäusematerial
Serie
Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
Min.: 100
Mult.: 100
: 100

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 75
Mult.: 75
: 75

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
Min.: 175
Mult.: 175
: 175

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 100
Mult.: 100
: 100

Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
Min.: 100
Mult.: 100
: 100

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 100
Mult.: 100
: 100

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 75
Mult.: 75
: 75

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Vorlaufzeit 3 Wochen
Min.: 1
Mult.: 1
: 325

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
Min.: 75
Mult.: 75
: 75

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 175
Mult.: 175
: 175

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 150
Mult.: 150
: 150

Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
Min.: 75
Mult.: 75
: 75

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
Min.: 75
Mult.: 75
: 75

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 1 Woche
Min.: 300
Mult.: 300
: 300

Sockets 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
Min.: 1
Mult.: 1
: 75

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 100
Mult.: 100
: 100

Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
Min.: 75
Mult.: 75
: 75

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 75
Mult.: 75
: 75

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 1 Woche
Min.: 175
Mult.: 175
: 175

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 100
Mult.: 100
: 100

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 175
Mult.: 175
: 175

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 100
Mult.: 100
: 100

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 50
Mult.: 50
: 50

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
Min.: 225
Mult.: 225
: 225

Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 9 Wochen
Min.: 100
Mult.: 100
: 100

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel