Tflex™ HD90000 Thermal Gap Filler

Laird Technologies Tflex™ HD90000 Thermal Gap Filler features a combination of 7.5W/mK thermal conductivity with superior pressure vs. deflection characteristics. This silicone-based thermal gap filler minimizes board and component stress. The ceramic-filled silicon sheets are offered in a variety of thicknesses ranging from 0.020" to 0.200". Laird Technologies Tflex™ HD90000 Thermal Gap Filler is an environmentally friendly solution that meets regulatory requirements, including RoHS and REACH.