Zipper Fin Heat Sink Assemblies

Aavid Zipper Fin Heat Sink Assemblies are suitable for air-cooled solutions for high-powered forced convection applications for mass production. These heat sinks are optimized for Intel® Xenon® processor microarchitecture in an FCLGA3647 package. The zipper fin stack is constructed from a series of individual sheet metal fins that are folded, stamped, and zipped together without using interlocking features. The thin fin geometry lowers pressure drops, improves system airflow, and reduces fan costs. Because the zipper fins are joined together on both the top and bottom of the fins, these heat sink assemblies offer high mechanical stability. Aavid Zipper Fin Heat Sink Assemblies are ideal for higher volume, high-performance applications.

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Aavid Wärmeableitungen Heat Sink for Intel Xeon, 108x78x25.2mm, Copper Plate/Heat Pipe Spreader Type
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36Auf Lager
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Mult.: 1

Heatpipe Assemblies Heat Sinks Panel Copper Zipper Fin 108 mm 78 mm 25.5 mm
Aavid Wärmeableitungen Heat Sink for Intel Xeon, 108x78x64mm, Copper Plate+Heat Pipe Spreader Type
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Nicht auf Lager

Heatpipe Assemblies Heat Sinks Panel Copper Zipper Fin 108 mm 78 mm 64 mm