|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-020-03.5-S-04-2-A-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6020035S042AF
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
80 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-025-03.5-S-06-2-L-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF602503.5S062
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
150 Position
|
0.635 mm (0.025 in)
|
6 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-025-03.5-L-04-2-L-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6025035L042LT
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
100 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-037-03.5-L-04-2-L-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF603703.5L042
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
148 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-037-03.5-S-04-2-L-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF603703.5S042L
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
148 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-037-03.5-S-04-2-T-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6037035S042TT
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
148 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-040-03.5-L-04-2-A-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6040035L042AF
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
160 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-040-03.5-L-04-2-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6040035L042FR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
160 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-040-03.5-S-04-2-A-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6040035S042AT
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
160 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-040-03.5-S-04-2-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6040035S042FR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
160 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-040-03.5-S-04-2-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6040035S042TR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
160 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-060-03.5-L-04-2-A-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6060035L042AF
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
240 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-060-03.5-L-04-2-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6060035L042FR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
240 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-060-03.5-L-04-2-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6060035L042TR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
240 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-060-03.5-S-04-2-A-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6060035S042AF
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
240 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-060-03.5-S-04-2-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6060035S042TR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-100-03.5-L-04-2-A-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6100035L042AF
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
100 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-100-03.5-L-04-2-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6100035L042TR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
400 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Straight
|
|
1.34 A
|
155 VAC
|
56 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
- APF6-100-03.5-S-04-2-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APF6100035S042FR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
|
|
|
|
|
|
|
Sockets
|
400 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Vertical
|
|
|
|
112 Gbps
|
- 40 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APF6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
- APM6-020-01.5-L-04-2-A-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APM6020015L042AF
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
|
|
|
|
|
|
|
Connectors
|
80 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder
|
Vertical
|
5 mm
|
1.2 A
|
150 VAC
|
112 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APM6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
- APM6-020-01.5-S-04-2-A-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APM6020015S042AF
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
|
|
|
|
|
|
|
Connectors
|
80 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder
|
Vertical
|
5 mm
|
1.2 A
|
150 VAC
|
112 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APM6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
- APM6-020-01.5-S-04-2-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APM6020015S042TR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
|
|
|
|
|
|
|
Connectors
|
80 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder
|
Vertical
|
5 mm
|
1.2 A
|
150 VAC
|
112 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APM6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
- APM6-020-06.5-L-04-2-FR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APM6020065L042FR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
|
|
|
|
|
|
|
Plugs
|
80 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Straight
|
10 mm
|
1.2 A
|
150 VAC, 212 VDC
|
112 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APM6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
- APM6-020-06.5-L-04-2-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APM6020065L042TR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
|
|
|
|
|
|
|
Connectors
|
80 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder
|
Vertical
|
10 mm
|
1.2 A
|
150 VAC
|
112 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APM6
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
- APM6-020-06.5-S-04-2-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-APM6020065S042TR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal
|
|
|
|
|
|
|
Headers
|
80 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder Balls
|
Straight
|
10 mm
|
1.34 A
|
155 VAC
|
56 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
APM6
|
Reel, Cut Tape
|
|