Tflex™ HR6.5 Thermal Gap Filler

Laird Technologies Tflex™ HR6.5 Thermal Gap Filler is a thermal interface material with >6W/mK thermal conductivity and high recovery properties. This filler is built to withstand cyclic gap changes due to shock, vibration, or warpage, providing consistent thermal performance over the part's life. HR6.5 material provides minimal stress on components, is easily assembled, and, in many cases, can be reused after rework due to its good rebound capability. Laird Technologies Tflex HR6.5 Thermal Gap Filler offers a 1mm to 5mm thickness range, ceramic-filled silicon sheet construction, a UL 94V-0 flammability rating, and a -50°C to +150°C operating temperature range.