5519-210x155-20

3M Electronic Specialty
517-5519-210X155-20
5519-210x155-20

Herst.:

Beschreibung:
Thermische Schnittstellenprodukte

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Auf Lager: 88

Lagerbestand:
88
sofort lieferbar
Auf Bestellung:
40
Lieferzeit ab Hersteller:
12
Wochen Geschätzte Produktionszeit des Werks für Mengen, die größer als angezeigt sind.
Minimum: 1   Vielfache: 1
Stückpreis:
-.-- CHF
Erw. Preis:
-.-- CHF
Vorauss. Zolltarif:
Dieses Produkt wird KOSTENLOS versandt

Preis (CHF)

Menge Stückpreis
Erw. Preis
61.60 CHF 61.60 CHF
60.81 CHF 608.10 CHF
50.62 CHF 1 012.40 CHF
49.54 CHF 2 972.40 CHF
48.22 CHF 4 822.00 CHF

Produktattribut Attributwert Attribut auswählen
3M
Produktkategorie: Thermische Schnittstellenprodukte
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermally Conductive Tape
Non-standard
Silicone Elastomer
5 W/m-K
Gray
- 50 C
+ 140 C
210 mm
155 mm
2 mm
UL 94 V-0
5519
Marke: 3M Electronic Specialty
Land der Bestückung: Not Available
Land der Verbreitung: Not Available
Ursprungsland: KR
Produkt-Typ: Thermal Interface Products
Verpackung ab Werk: 20
Unterkategorie: Thermal Management
Artikel # Aliases: 5519 7100139349
Gewicht pro Stück: 204,120 g
Produkte gefunden:
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Um ähnliche Produkte in dieser Kategorie anzuzeigen, wählen Sie mindestens ein Kontrollkästchen oben aus.
Ausgewählte Attribute: 0

USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.